• Categories:Industry News
• Author:Becky Su
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• Time of issue:2023-03-18 11:00
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(Summary description)SMT process terminology 1、Surface mount assembly (SMA) (surface mount assemblys) Surface mount technology is used to complete the mounting of printed board assembly parts. 2、Reflow soldering（reflowsoldering） By melting the solder paste which is pre-distributed to the PCB pads, realize the connection between surface mount components and PCB pads. 3、Wave soldering (wavesoldering) The dissolved solder, through the special equipment spray flow into the design requirements of the solder wave, so that the PCB pre-equipped with electronic components through the solder wave, to achieve the connection between the device and the PCB pads. 4、Fine pitch (finepitch) Less than 0.5mm pin pitch 5、Pin coplanarity ( leadcoplanarity ) Refers to the surface mount component pin vertical height deviation, namely the pin * high foot bottom and * low pin bottom form the plane which between the vertical distance. Its value is generally not greater than 0.1mm. 6、Solder paste (solderpaste) By the powdered solder alloy, flux and some play a sticky role and other role of additives mixed into a certain viscosity and good thixotropy of the solder paste. 7、Curing (curing) In a certain temperature, time conditions, heating the placement of the components of the chip adhesive, in order to make the components and PCB board temporarily fixed together in the process. 8、Patch adhesive or called red glue (adhesives) (SMA) Before curing has a certain initial viscosity has a shape, after curing has sufficient adhesive strength of the gel. 9、dispensing (dispensing) When the surface mount, to the PCB to apply the process of chip adhesive. 10、Dispensing machine (dispenser) Can complete the dispensing operation equipment. 11、Placement (pickandplace) The operation of picking up and placing surface-mounted components from the feeder to the prescribed position on the PCB. 12、Patching machine (placementequipment) Finish surface mount component placement function of special process equipment. 13、 High-speed placement machine (high placement equipment ) The actual placement speed is greater than 20,000 points / hour placement machine. 14、 Multi-function placement machine (multi-function placement equipment ) Used to mount the surface mount device with larger body shape and smaller lead pitch, and requires higher placement accuracy. 15、 Hot air reflow soldering ( hotairreflow soldering ) The reflow soldering which heats up by the forced circulating hot air flow. 16、Patching inspection ( placement inspection ) After the completion of the patching, for whether there is leakage, misalignment, paste the wrong, components damage and other quality inspection. 17、 Stencil printing (metal stencil printing ) The use of stainless steel stencil will be printed on the PCB pad solder paste printing process. 18、 Printing machine (printer) In SMT, stencil printing for special equipment. 19, after the furnace inspection (inspection after soldering ) The quality inspection of the PCBA soldered or cured by the reflow oven after the patching is completed. 20、Inspection before soldering    After the completion of the patch in the reflow oven soldering or curing before the patch quality inspection. 21、Reworking (reworking ) To remove local defects in the PCBA and the repair process. 22, rework station (reworkstation ) Can have quality defects of the PCBA for reworking special equipment.