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Leading Apple, Huawei will release the world’s first 5nm Kirin processor

Leading Apple, Huawei will release the world’s first 5nm Kirin processor

  • Categories:Industry News
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  • Time of issue:2020-09-05 13:44
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(Summary description)According to the previous regulations, TSMC will not be able to produce chips for Huawei after September 15th, and as time approaches, TSMC has also carried out the final rush, and it is concentrating all its efforts to produce Kirin cores based on 5nm in order to try its best Guarantee the use of Mate 40 series.

Leading Apple, Huawei will release the world’s first 5nm Kirin processor

(Summary description)According to the previous regulations, TSMC will not be able to produce chips for Huawei after September 15th, and as time approaches, TSMC has also carried out the final rush, and it is concentrating all its efforts to produce Kirin cores based on 5nm in order to try its best Guarantee the use of Mate 40 series.

  • Categories:Industry News
  • Author:
  • Origin:
  • Time of issue:2020-09-05 13:44
  • Views:
Information

TSMC is in the final rush production

 

According to the previous regulations, TSMC will not be able to produce chips for Huawei after September 15th, and as time approaches, TSMC has also carried out the final rush, and it is concentrating all its efforts to produce Kirin cores based on 5nm in order to try its best Guarantee the use of Mate 40 series.

Sources in the upstream chip industry chain bluntly stated that the number of Kirin processor chips that Huawei needs by the end of the year, whether 5nm, 7nm, or 16nm, 28nm, such as HiSilicon’s self-developed TWS headset Bluetooth chip, will be all by mid-September. Delivery, the current production capacity is advancing smoothly, so it will not delay the release and listing of the established models.

 In addition to 5nm, TSMC is also producing more 7nm chips at Huawei to ensure that more mobile phones are used. At present, the main sales force of Huawei's mobile phones is mainly concentrated on models equipped with 7nm process processors, but even in the final rush, No other manufacturer is willing to temporarily contribute production capacity to Huawei, because everyone has basically reached the stage of intensively launching new products. At the same time, TSMC’s 7nm and 5nm process capacity is very limited.

 

Kirin core may become a swan song

 

Due to the frenzied suppression by the United States, Yu Chengdong said in a previous public speech that the Kirin 9000 that will be equipped with the Mate 40 that will be launched this fall may be out of print of Huawei's high-end chips. Yu Chengdong disclosed in his speech that Huawei Mate 40 is equipped with our new generation of Kirin 9000 chip, which will have more powerful 5G capabilities, more powerful AI processing capabilities, and more powerful CPU and GPU.

But unfortunately, in the second round of sanctions in the United States, our chip production only accepted orders before September 15th, and production ended on September 15. So this year may be the last generation of Huawei's high-end Kirin chips. "Yu Chengdong said helplessly.

In response to external attacks, Huawei has now publicly stated that it will work with Chinese companies to break through core chips and operating systems. Huawei acknowledges that the core technology of China's terminal industry is far from that of the United States, but they hope that Chinese companies can start from the root technology to create a new ecosystem, unite and break through the core technology.

According to the details of the previous sanctions, as long as the semiconductor production process, even if any US technology is used, it cannot be produced by Huawei. In this regard, Huawei was also very helpless. They are also regretful. The first is to explore in the chip field. In the past, Huawei has been developing for more than ten years. It has been blocked again.

Another point is that it has invested a huge amount of R&D investment and has gone through a very difficult process, but it is a pity that Huawei is in semiconductor manufacturing. Huawei is in the field of heavy asset investment. This kind of capital-intensive industry, Huawei does not have Participating, they only achieved chip design, but did not engage in chip manufacturing, which is a very big loss for Huawei.

 

The 30 million 5G chips prepared by MediaTek may not be shipped

 

The industry chain also mentioned in the latest news that due to the upgraded ban requirements in the United States, the 5G chips prepared by MediaTek for Huawei mobile phones cannot be shipped and can only be digested by Xiaomi, OPPO and vivo.

Huawei Japan publicly stated that semiconductor chips are currently restricted by the ban, and other parts and components will not be affected.

 

Work together with Chinese manufacturers to take root in semiconductors in all directions

 

Of course, Huawei is not just shouting slogans, because only by being strong can it be truly fearless of sanctions. In terms of semiconductors, Huawei’s latest attitude is to take root in all directions and break through the basic research and precision manufacturing of physical materials. In terms of terminal devices, such as display modules, camera modules, and 5G devices, Huawei is vigorously increasing its investment in materials and core technologies, realizing close linkage of new materials + new processes, and breaking through bottlenecks that restrict innovation.

Because the semiconductor industry chain is very long, not one or two companies can do everything, but Huawei also stated that Huawei is investing in multiple devices in the terminal, which has also driven the growth of a group of Chinese companies, including Radio frequency and so on leap to high-end manufacturing.

 Specifically, Huawei recommends that the industry pay attention to the EDA and IP fields, key algorithms and design capabilities. There are also production equipment and materials fields including 12-inch wafers, photomasks, EUV light sources, immersive systems, lenses, etc. In the design and manufacturing process, attention is paid to IC design capabilities, IC manufacturing and IC packaging and testing capabilities. Among them, IDM covers the design and manufacturing process integration of radio frequency, power, analog, storage, sensor and other devices.

 

---The original text comes from the SMT Home Forum

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