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Common structure of SMD machine

Common structure of SMD machine

  • Categories:Industry News
  • Author:Becky Su
  • Origin:
  • Time of issue:2022-12-20 14:28
  • Views:

(Summary description)Common structure of SMD machine The structure of SMD machine can be divided into 4 types of structure: compound type, arch type, turret type and large parallel system. 1、Compound type. Composite machine is developed from the arch type machine, it combines the features of turret type and arch type, there are turntables installed on the movable arm, like Siemens' Siplace 80S25 bonder, there are two rotary heads with 12 nozzles. Since the compound machine can increase the speed by increasing the number of movable arms, it has more flexibility, so its development prospect is favored, such as Siemens introduced the HS60 machine is installed with four rotary head, placement speed of up to 60,000 pieces per hour. universal also introduced the rotary head with 30 nozzles, called " Lightning Head", two such rotary heads mounted on the Genesis placement platform, can achieve a placement speed of 60,000 pieces per hour. In a strict sense, the composite machine still belongs to the moving arm structure.   2、Arch type. Arch-frame (also known as moving arm) machines are *traditional* bonder machines with better flexibility and accuracy for most components, high precision machines are generally of this type, but their speed cannot be compared with compound, turret and mega parallel systems. The arch type machine is divided into single arm type and multi-arm type. The single arm type is the *early developed multifunctional bonder still in use today. The dobby mounter developed on the basis of the single-arm type can increase the work efficiency exponentially, such as the GSM2 mounter of Universal Corporation in the United States has two movable arm mounting heads, which can alternately mount two PCBs (PrintCircuitBoard) at the same time. The majority of bonder manufacturers have introduced high-precision bonder and medium-speed bonder with this structure, such as AC72 from Universal, AQ-1 from Assembleon, TIM-X from Hitachi, QP-341E and XP series from Fuji, BM221 from Panasonic, and BM221 from Samsung. BM221, CP60 series from Samsung of Korea, YV series from Yamaha of Japan, and KE series from Juki of Japan. However, the component arrangement is increasingly concentrated on active parts, such as leaded QFP (Quadflat package, Quadrilateral flat package device) and BGA (Ball gridarray, Ball grid array device), where mounting accuracy plays a vital role in high yield. Composite, turret and large parallel systems are generally not suitable for this type of component mounting.   3. Turret type. Turret type machines are mainly used in the production of large-scale computer boards, cell phones, home appliances and other products, this is because in these products, resistive components are particularly large, high assembly density, very suitable for ** with this model for production. A considerable number of Taiwan-invested, Hong Kong-invested electronic assembly enterprises and domestic electrical manufacturers are using this model to meet the requirements of high-speed assembly. The concept of the turret is to use a set of moving feeders from which the turret picks up components and then places them on top of the circuit board located on a moving table. The turret type machine makes the placement speed increase significantly due to the simultaneous picking up of components and placement action. This kind of structure high speed mount machine in our country's application is also very common, not only the speed is fast, and after more than ten years of development technology has been very mature, such as Fuji company's CP842E machine mount speed can reach 0.068 seconds / piece. But this kind of machine because the mechanical structure is limited, its pasting speed has reached a limit value, not possible to improve greatly again. The shortcoming of this model is only can deal with the strip material.   4、Massive parallel system. Large-scale parallel system (also called module machine) uses a series of small individual placement unit (also called module). Each unit has its own filament position system, mounted with a camera and a mounting head. For example, Assembleon's AX-5 machine can* have up to 20 placement heads, achieving a placement speed of 150,000 pieces per hour, which is considered to be the industry**, but for each placement head, the placement speed is around 7,500 pieces per hour, and there is still a possibility of substantial improvement. This type of machine is also mainly suitable for large-scale production, such as cell phones. The manufacturer who produces the mass parallel system type machine mainly has Assembleon, Fuji also launched the NXT type super high speed mounter which adopts the similar structure, by carrying the mount work head which can be changed, the same machine can be both the high speed machine and the universal machine, almost can carry out the mount of all mount components, thus the initial investment of the equipment and the increase equipment investment is reduced to * Low degree. Each place

Common structure of SMD machine

(Summary description)Common structure of SMD machine

The structure of SMD machine can be divided into 4 types of structure: compound type, arch type, turret type and large parallel system.
1、Compound type. Composite machine is developed from the arch type machine, it combines the features of turret type and arch type, there are turntables installed on the movable arm, like Siemens' Siplace 80S25 bonder, there are two rotary heads with 12 nozzles. Since the compound machine can increase the speed by increasing the number of movable arms, it has more flexibility, so its development prospect is favored, such as Siemens introduced the HS60 machine is installed with four rotary head, placement speed of up to 60,000 pieces per hour. universal also introduced the rotary head with 30 nozzles, called " Lightning Head", two such rotary heads mounted on the Genesis placement platform, can achieve a placement speed of 60,000 pieces per hour. In a strict sense, the composite machine still belongs to the moving arm structure.
 
2、Arch type. Arch-frame (also known as moving arm) machines are *traditional* bonder machines with better flexibility and accuracy for most components, high precision machines are generally of this type, but their speed cannot be compared with compound, turret and mega parallel systems. The arch type machine is divided into single arm type and multi-arm type. The single arm type is the *early developed multifunctional bonder still in use today. The dobby mounter developed on the basis of the single-arm type can increase the work efficiency exponentially, such as the GSM2 mounter of Universal Corporation in the United States has two movable arm mounting heads, which can alternately mount two PCBs (PrintCircuitBoard) at the same time. The majority of bonder manufacturers have introduced high-precision bonder and medium-speed bonder with this structure, such as AC72 from Universal, AQ-1 from Assembleon, TIM-X from Hitachi, QP-341E and XP series from Fuji, BM221 from Panasonic, and BM221 from Samsung. BM221, CP60 series from Samsung of Korea, YV series from Yamaha of Japan, and KE series from Juki of Japan. However, the component arrangement is increasingly concentrated on active parts, such as leaded QFP (Quadflat package, Quadrilateral flat package device) and BGA (Ball gridarray, Ball grid array device), where mounting accuracy plays a vital role in high yield. Composite, turret and large parallel systems are generally not suitable for this type of component mounting.
 
3. Turret type. Turret type machines are mainly used in the production of large-scale computer boards, cell phones, home appliances and other products, this is because in these products, resistive components are particularly large, high assembly density, very suitable for ** with this model for production. A considerable number of Taiwan-invested, Hong Kong-invested electronic assembly enterprises and domestic electrical manufacturers are using this model to meet the requirements of high-speed assembly. The concept of the turret is to use a set of moving feeders from which the turret picks up components and then places them on top of the circuit board located on a moving table. The turret type machine makes the placement speed increase significantly due to the simultaneous picking up of components and placement action. This kind of structure high speed mount machine in our country's application is also very common, not only the speed is fast, and after more than ten years of development technology has been very mature, such as Fuji company's CP842E machine mount speed can reach 0.068 seconds / piece. But this kind of machine because the mechanical structure is limited, its pasting speed has reached a limit value, not possible to improve greatly again. The shortcoming of this model is only can deal with the strip material.
 
4、Massive parallel system. Large-scale parallel system (also called module machine) uses a series of small individual placement unit (also called module). Each unit has its own filament position system, mounted with a camera and a mounting head. For example, Assembleon's AX-5 machine can* have up to 20 placement heads, achieving a placement speed of 150,000 pieces per hour, which is considered to be the industry**, but for each placement head, the placement speed is around 7,500 pieces per hour, and there is still a possibility of substantial improvement. This type of machine is also mainly suitable for large-scale production, such as cell phones. The manufacturer who produces the mass parallel system type machine mainly has Assembleon, Fuji also launched the NXT type super high speed mounter which adopts the similar structure, by carrying the mount work head which can be changed, the same machine can be both the high speed machine and the universal machine, almost can carry out the mount of all mount components, thus the initial investment of the equipment and the increase equipment investment is reduced to * Low degree. Each place

  • Categories:Industry News
  • Author:Becky Su
  • Origin:
  • Time of issue:2022-12-20 14:28
  • Views:
Information

Common structure of SMD machine

The structure of SMD machine can be divided into 4 types of structure: compound type, arch type, turret type and large parallel system.
1、Compound type. Composite machine is developed from the arch type machine, it combines the features of turret type and arch type, there are turntables installed on the movable arm, like Siemens' Siplace 80S25 bonder, there are two rotary heads with 12 nozzles. Since the compound machine can increase the speed by increasing the number of movable arms, it has more flexibility, so its development prospect is favored, such as Siemens introduced the HS60 machine is installed with four rotary head, placement speed of up to 60,000 pieces per hour. universal also introduced the rotary head with 30 nozzles, called " Lightning Head", two such rotary heads mounted on the Genesis placement platform, can achieve a placement speed of 60,000 pieces per hour. In a strict sense, the composite machine still belongs to the moving arm structure.
 
2、Arch type. Arch-frame (also known as moving arm) machines are *traditional* bonder machines with better flexibility and accuracy for most components, high precision machines are generally of this type, but their speed cannot be compared with compound, turret and mega parallel systems. The arch type machine is divided into single arm type and multi-arm type. The single arm type is the *early developed multifunctional bonder still in use today. The dobby mounter developed on the basis of the single-arm type can increase the work efficiency exponentially, such as the GSM2 mounter of Universal Corporation in the United States has two movable arm mounting heads, which can alternately mount two PCBs (PrintCircuitBoard) at the same time. The majority of bonder manufacturers have introduced high-precision bonder and medium-speed bonder with this structure, such as AC72 from Universal, AQ-1 from Assembleon, TIM-X from Hitachi, QP-341E and XP series from Fuji, BM221 from Panasonic, and BM221 from Samsung. BM221, CP60 series from Samsung of Korea, YV series from Yamaha of Japan, and KE series from Juki of Japan. However, the component arrangement is increasingly concentrated on active parts, such as leaded QFP (Quadflat package, Quadrilateral flat package device) and BGA (Ball gridarray, Ball grid array device), where mounting accuracy plays a vital role in high yield. Composite, turret and large parallel systems are generally not suitable for this type of component mounting.
 
3. Turret type. Turret type machines are mainly used in the production of large-scale computer boards, cell phones, home appliances and other products, this is because in these products, resistive components are particularly large, high assembly density, very suitable for ** with this model for production. A considerable number of Taiwan-invested, Hong Kong-invested electronic assembly enterprises and domestic electrical manufacturers are using this model to meet the requirements of high-speed assembly. The concept of the turret is to use a set of moving feeders from which the turret picks up components and then places them on top of the circuit board located on a moving table. The turret type machine makes the placement speed increase significantly due to the simultaneous picking up of components and placement action. This kind of structure high speed mount machine in our country's application is also very common, not only the speed is fast, and after more than ten years of development technology has been very mature, such as Fuji company's CP842E machine mount speed can reach 0.068 seconds / piece. But this kind of machine because the mechanical structure is limited, its pasting speed has reached a limit value, not possible to improve greatly again. The shortcoming of this model is only can deal with the strip material.
 
4、Massive parallel system. Large-scale parallel system (also called module machine) uses a series of small individual placement unit (also called module). Each unit has its own filament position system, mounted with a camera and a mounting head. For example, Assembleon's AX-5 machine can* have up to 20 placement heads, achieving a placement speed of 150,000 pieces per hour, which is considered to be the industry**, but for each placement head, the placement speed is around 7,500 pieces per hour, and there is still a possibility of substantial improvement. This type of machine is also mainly suitable for large-scale production, such as cell phones. The manufacturer who produces the mass parallel system type machine mainly has Assembleon, Fuji also launched the NXT type super high speed mounter which adopts the similar structure, by carrying the mount work head which can be changed, the same machine can be both the high speed machine and the universal machine, almost can carry out the mount of all mount components, thus the initial investment of the equipment and the increase equipment investment is reduced to * Low degree. Each placement head can absorb a limited number of tape feeders and place a part of the PCB, which is advanced step by step in the machine at a fixed interval. Individually each unit machine runs slower. However, their continuous or parallel operation results in high throughput.

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