Control method of SMT material consumption As the question, I believe this problem is troubling many SMT people. In fact, the key to control SMT material consumption is to improve the measures 　A, control the artificial waste　　 1, the use of materials and the number of returns should be carefully verified every day. 2, disassembly material improper waste: training of equipment operators, corresponding to the form of packaging using the corresponding material frame 　　3、Waste of using wrong material, heavy industry: each shift should have 3 times to check the material, change the material corresponding to the material tray in the way of one for one, confirmed by special personnel, and test the value. 　  4、In order to pursue the output, the operators change the material in advance and consume the material without finishing. This phenomenon should be supervised to avoid. 　　5、The abnormal consumption caused by machine and equipment failure. Timely detection of the problem can minimize the loss. 　　6, for the normal production on the line when the residual products generated by the rework consumption, this is not yet controlled. 　　 Second, the material loss of serious control measures, performance for the people \ machine \ material \ law 　　People: mainly refers to the production line operators, usually they are on the material, down the line, in the end there is no real view of each material as gold, fell on the ground material has not put up, and hand swing. Machine frequent alarm when whether timely reflection of engineering, etc. 　　Machine: usually whether the machine is practically executed maintenance operation, whether the nozzle is often cleaned and tested, whether the material frame is often maintained and corrected, whether the program is correctly written, etc. 　 Material: whether the material has incoming material abnormality, such as incoming material packing is too tight, can't get material throwing material; incoming material is broken, replacement loss, etc. 　　Law: such as the operator's proficiency in operating the machine, the ability to distinguish and reasonably use the material frame, etc. 　　 　In summary, the control of SMT material consumption from a variety of aspects, and long-term implementation of reasonable methods.

Happy New Year 2023! Blue Fish/ZK Electronic would like to wish you a joyous new year and express our hope for your happiness and good future 2023!

SMT Production Line Analysis SMT production line to achieve * the maximum output, it is necessary to consider the efficiency of the production line. The SMT machine is the key equipment in the SMT production line, so it is very important to improve the production efficiency of the SMT machine. Relevant methods and measures have been summarized and have been implemented to substantially improve production efficiency. The main methods and measures are as follows: (1) PCB design process; (2) production line balance; (3) equipment program optimization; (4) management measures; (5) improve the accuracy of new program preparation; (6) good equipment monitoring and maintenance In addition, understanding the SMT production process is also very important, the following is introduced.   Basic process components include: screen printing (or dispensing), placement (curing), reflow soldering, cleaning, testing, rework    1、Silkscreen printing: its role is the solder paste or patch adhesive leakage printed on the pads of the PCB, in preparation for the welding of components. The equipment used for screen printing machine (screen printer), the printer is located in the front of the SMT production line *.    2, dispensing: it is the glue drops to the PCB's fixed position, its main role is to fix the components to the PCB board. The equipment used is the dispensing machine, located in the front of the SMT production line * or behind the testing equipment.    3、Placement: Its role is to accurately install the surface assembly components to the PCB's fixed position. The equipment used is the mounter, located in the SMT production line behind the screen printing machine.    4、Reflow soldering: its role is to melt the solder paste, so that the surface assembly components and PCB board firmly bonded together. The equipment used is reflow oven, located in the SMT production line behind the mounting machine.    5, cleaning: its role is to assemble the PCB board above the harmful welding residues such as flux removed. The equipment used for cleaning machine, the location can not be fixed, can be online, or not online.    6, testing: its role is to assemble the PCB board for the quality of welding and assembly quality testing. The equipment used are magnifying glass, microscope, online tester (ICT), flying probe tester, automatic optical inspection (AOI), X-RAY inspection system, functional tester, etc. Location according to the needs of detection, can be configured in the production line appropriate place.    7, rework: its role is to detect the failure of the PCB board rework. The tools used are soldering iron, reworking workstation, etc. Configured in any position in the production line. Such as BGA rework table. Translated with www.DeepL.com/Translator (free version)

SMT Common Knowledge SMT Common Knowledge Introduction　 　   1 . Generally speaking, the temperature of SMT workshop is 25±3℃.  　　2. Solder paste printing, the materials and tools needed to prepare the paste, steel plate, scraper, wipe paper, dust-free paper, cleaning agent, stirring knife.    　　3. generally used alloy composition of the paste is Sn / Pb alloy, and the alloy ratio of 63/37. 4.    　　4. The main components of the solder paste is divided into two major components of tin powder and flux. 5.    　　5 flux in the soldering of the main role is to remove the oxide, destroy the surface tension of molten tin, to prevent re-oxidation. 6.    　　6. The volume ratio of tin powder particles to Flux (flux) in solder paste is about 1:1, and the weight ratio is about 9:1.    　　7. The principle of taking solder paste is first in first out. 8.    　　8. when the paste is opened and used, it must go through two important processes: tempering and stirring.    　　9. The common production methods of steel plate are: etching, laser, electroforming.    　　10. The full name of SMT is Surfacemount (or mounting) technology, Chinese meaning for surface adhesion (or mounting) technology. 11.    　　11. the full name of ESD is Electro-static discharge, the Chinese meaning is electrostatic discharge.    　　12. When making SMT equipment program, the program includes five major parts, this five parts are substrate data; mounting data; loading data; component data; absorbing data, image data.    　　13. lead-free solder Sn/Ag/Cu 96.5/3.0/0.5 melting point of 217C. 14.    　　14. The controlled relative temperature and humidity of the parts drying oven is < 10%.    　　15. commonly used passive components (PassiveDevices) are: resistance, capacitance, point sense (or dipole), etc.; active components (ActiveDevices) are: crystals, IC, etc.    　　16. The material of the commonly used SMT steel plate is stainless steel.    　　17. The thickness of the commonly used SMT steel plate is 0.15mm (or 0.12mm).    　　18. The types of electrostatic charge generated by friction, separation, induction, electrostatic conduction, etc.; electrostatic charge on the electronics industry: ESD failure, electrostatic pollution; electrostatic elimination of the three principles of electrostatic neutralization, grounding, shielding.    　　19. imperial size LxW 0603=0.06inch*0.03inch, metric size LxW 3216=3.2mm*1.6mm.    　　20. The 8th code "4" of ERB-05604-J81 indicates 4 circuits with 56 ohms resistance value. Capacitor ECA-0105Y-M31 capacitance C = 106PF = 1NF = 1X10-6F.    　　21. ECN Chinese full name: engineering change notice; SWR Chinese full name: special requirements work order, must be countersigned by the relevant departments, the documentation center to distribute, in order to be effective.    　　22. 5S specific content for the organization, tidying, cleaning, cleanliness, literacy.    　　23. The purpose of PCB vacuum packaging is to prevent dust and moisture.    　　24. The quality policy is: **Quality control, implementation of the system, to provide the quality of customer needs; full participation, timely processing, to achieve the goal of zero defects.    　　25. The three no policies of quality are: do not accept ** products, do not manufacture ** products, and do not flow out ** products.    　　26. QC seven techniques in the fishbone check the cause of 4M1H are (Chinese): people, machines, materials, methods, environment.    　　27. The composition of the solder paste contains: metal powder, solution, flux, anti-drop agent, active agent; by weight, metal powder accounts for 85-92%, by volume metal powder accounts for 50%; where the main components of metal powder for tin and lead, the ratio of 63/37, the melting point of 183 ℃.    　　28. Solder paste must be taken out of the refrigerator when using back to temperature, the purpose is: let the refrigerated temperature of the paste back to room temperature, in order to facilitate printing. If not return to temperature in the PCBA into the Reflow easy to produce ** for tin beads.    　　29. the machine's file supply mode are: ready mode, priority exchange mode, exchange mode and quick connect mode.    　　30. SMT PCB positioning methods are: vacuum positioning, mechanical hole positioning, bilateral clamping positioning and board edge positioning.         31. The resistor with a silkscreen (symbol) of 272 has a resistance value of 2700Ω, and the resistor with a resistance value of 4.8MΩ has a symbol (silkscreen) of 485.    　　32. The silkscreen on the BGA body contains information such as manufacturer, manufacturer's part number, specification, and Datecode/(Lot No).    　　33. The pitch of 208pin QFP is 0.5mm.    　　34. the seven QC practices, the fishbone diagram emphasizes the search for cause-and-effect relationships;    　　35. CPK refers to the current process capability under actual conditions;    　　36. Flux starts to evaporate in the constant temperature zone for chemical cleaning act