SMT Common Knowledge SMT Common Knowledge Introduction　 　   1 . Generally speaking, the temperature of SMT workshop is 25±3℃.  　　2. Solder paste printing, the materials and tools needed to prepare the paste, steel plate, scraper, wipe paper, dust-free paper, cleaning agent, stirring knife.    　　3. generally used alloy composition of the paste is Sn / Pb alloy, and the alloy ratio of 63/37. 4.    　　4. The main components of the solder paste is divided into two major components of tin powder and flux. 5.    　　5 flux in the soldering of the main role is to remove the oxide, destroy the surface tension of molten tin, to prevent re-oxidation. 6.    　　6. The volume ratio of tin powder particles to Flux (flux) in solder paste is about 1:1, and the weight ratio is about 9:1.    　　7. The principle of taking solder paste is first in first out. 8.    　　8. when the paste is opened and used, it must go through two important processes: tempering and stirring.    　　9. The common production methods of steel plate are: etching, laser, electroforming.    　　10. The full name of SMT is Surfacemount (or mounting) technology, Chinese meaning for surface adhesion (or mounting) technology. 11.    　　11. the full name of ESD is Electro-static discharge, the Chinese meaning is electrostatic discharge.    　　12. When making SMT equipment program, the program includes five major parts, this five parts are substrate data; mounting data; loading data; component data; absorbing data, image data.    　　13. lead-free solder Sn/Ag/Cu 96.5/3.0/0.5 melting point of 217C. 14.    　　14. The controlled relative temperature and humidity of the parts drying oven is < 10%.    　　15. commonly used passive components (PassiveDevices) are: resistance, capacitance, point sense (or dipole), etc.; active components (ActiveDevices) are: crystals, IC, etc.    　　16. The material of the commonly used SMT steel plate is stainless steel.    　　17. The thickness of the commonly used SMT steel plate is 0.15mm (or 0.12mm).    　　18. The types of electrostatic charge generated by friction, separation, induction, electrostatic conduction, etc.; electrostatic charge on the electronics industry: ESD failure, electrostatic pollution; electrostatic elimination of the three principles of electrostatic neutralization, grounding, shielding.    　　19. imperial size LxW 0603=0.06inch*0.03inch, metric size LxW 3216=3.2mm*1.6mm.    　　20. The 8th code "4" of ERB-05604-J81 indicates 4 circuits with 56 ohms resistance value. Capacitor ECA-0105Y-M31 capacitance C = 106PF = 1NF = 1X10-6F.    　　21. ECN Chinese full name: engineering change notice; SWR Chinese full name: special requirements work order, must be countersigned by the relevant departments, the documentation center to distribute, in order to be effective.    　　22. 5S specific content for the organization, tidying, cleaning, cleanliness, literacy.    　　23. The purpose of PCB vacuum packaging is to prevent dust and moisture.    　　24. The quality policy is: **Quality control, implementation of the system, to provide the quality of customer needs; full participation, timely processing, to achieve the goal of zero defects.    　　25. The three no policies of quality are: do not accept ** products, do not manufacture ** products, and do not flow out ** products.    　　26. QC seven techniques in the fishbone check the cause of 4M1H are (Chinese): people, machines, materials, methods, environment.    　　27. The composition of the solder paste contains: metal powder, solution, flux, anti-drop agent, active agent; by weight, metal powder accounts for 85-92%, by volume metal powder accounts for 50%; where the main components of metal powder for tin and lead, the ratio of 63/37, the melting point of 183 ℃.    　　28. Solder paste must be taken out of the refrigerator when using back to temperature, the purpose is: let the refrigerated temperature of the paste back to room temperature, in order to facilitate printing. If not return to temperature in the PCBA into the Reflow easy to produce ** for tin beads.    　　29. the machine's file supply mode are: ready mode, priority exchange mode, exchange mode and quick connect mode.    　　30. SMT PCB positioning methods are: vacuum positioning, mechanical hole positioning, bilateral clamping positioning and board edge positioning.         31. The resistor with a silkscreen (symbol) of 272 has a resistance value of 2700Ω, and the resistor with a resistance value of 4.8MΩ has a symbol (silkscreen) of 485.    　　32. The silkscreen on the BGA body contains information such as manufacturer, manufacturer's part number, specification, and Datecode/(Lot No).    　　33. The pitch of 208pin QFP is 0.5mm.    　　34. the seven QC practices, the fishbone diagram emphasizes the search for cause-and-effect relationships;    　　35. CPK refers to the current process capability under actual conditions;    　　36. Flux starts to evaporate in the constant temperature zone for chemical cleaning act

FUJI NXT mounter There is no waste corresponding to the module that achieves high quality placement.   FUJI NXT mounter It is possible to constitute a production line with reasonable cost that matches the production pattern. It is possible to introduce the necessary equipment when necessary and to anticipate the correspondence for the future technology.   Flexible change of machine composition Not only when installing the machine, but also when changing the working head after the production line is in operation and changing the die set can be done more easily than before. This enables dynamic line changes beyond the range of common knowledge, in line with the new production methods that require rapid changes.  

Ultra-high speed modular bonder cm602 Ultra-high speed modular bonder cm602 CM402 created the myth of SMT sales, in just over 2 years time global sales of more than 3000 units. With its flexible, combination of stable production and ** cost-effective loved by the majority of customers, widely used in notebooks, MP4, cell phones, digital products, automotive electronics and other ** industry. With the continuous improvement of product processing technology, the placement machine also put forward higher requirements. In order to meet the requirements of industry development and better serve our customers, Panasonic Industrial Co., Ltd. has improved and developed the CM602, a new generation of mounter**, based on the original CM402.   The CM602 not only uses the original CM402 modules, but also adds a new 12-nozzle high-speed head and direct-absorbing tray as needed, expanding the original 8-nozzle high-speed bonder head function, plus the 3-nozzle multifunctional head with pressure control function, making it as many as 10 different module combinations, truly modular, allowing customers to combine and match at will. The high speed version of CM602* reaches a high speed of CPH100,000, and the speed of a single bonder head reaches CPH25,000, which is unmatched by other equipment in the industry at present. New linear motors are adopted for both XY axes to provide strong power to CM602.    ● The motion arm beam and head adopt new design and material, which not only reduce the weight but also greatly strengthen the rigidity, making it more stable during the motion.    ● High-speed and low-vibration design has been adopted for the X Y axis movement.    ● The linear motor adopts a new cooling design scheme, which enables faster and more effective cooling than other equipment using linear motors in high-speed motion, ensuring efficient operation and increasing the life of the motor.    The 7 types of racks can be used for all kinds of ribbon packaging components from 8mm to 104mm, which is the most versatile and widely applicable equipment in the industry. The new 8 mm single rack has been added according to customer demand.    The design of the overall exchange cart and the overall exchange support pin can greatly improve the operation efficiency and the machine switching time.    While improving productivity, the software, hardware, and operation are all based on the proven design of the CM402, ensuring interchangeability with the CM402. Equipment name ： CM602 Power supply: 3 phase 200/220/380/400/420/480V 50/60Hz 4KVA Air pressure: 0.49-0.78MPa 170L/min Equipment size: W2350xD2690xH1430mm Operation: color LCD touch panel, Chinese, Japanese and English three kinds of one-touch switch Object component: 0603-100X90mm Number of tape: Multi 216 stations 8mm tape Object substrate: 50X50-510X460mm  

Modular mounter cm402 PanasonicCM402 Single Platform Solution: One Platform Industry* high productivity, 0.06S/CHIP (60,000cph) Flexible variety switching capability and wide range of component matching capability High production capacity. - Achieves high speed with a capacity of 60,000 CPH (system upgrade capable of reaching 66,000 CPH) - Substrate delivery time* as fast as 0.9 seconds. Flexible substrate transport, reducing lost transport time High efficiency. - CP/CPK self-check function, customers can check the accuracy of the equipment themselves during the use of the equipment - 0603 narrow pitch placement component absorption rate and product once pass through rate is the highest in the business world*, such as the current mass production of Ipod MP3 - To realize 100% automatic insertion of hand inserted components by program-controlled precision pressure insertion. For example: I/O port, shaped connector, copper column, etc. Flexible wiring options. Based on a single platform design, the CM402A/B/C models can be changed to high-speed machines/universal machines/combined machines by simply changing the head and adding a tray feeder (TRAY) - Highly efficient production with a large number of proven reliable designs that significantly reduce downtime - Fewer types of production line carriers in the world*. A total of 5 types of racks can be used for all types of tape elements. - Intelligent tape racking, automatic selection of transfer method according to components, and various other intelligent functions - Single machine* can mount up to 216 types of components - A bracket type trolley exchange connection / braiding / shelf and other filling peripheral devices to achieve non-stop material change, the actual production cranking rate of 85%-90% High placement accuracy. - High-precision placement 50μm (Cpk≧1.0) high-precision base-machine, and with high-precision calibration function and - A variety of flexible combination of ways to meet the different needs of production Perfect software system. - Simple process software, a one-time completion of the single machine optimization and production line balance optimization - LINE COMPUTER management system to monitor production management information and material usage at all times - IPC intelligent component tracking system, not only to track PCB ID and prevent material change errors, but also to monitor and provide feedback to the entire production line (including monitoring of printing presses and reflow ovens) at all times. Equipment name ：CM402 Type of mounting head: High-speed general purpose No. of nozzles: 8 nozzles / head × 4 3 nozzles / head × 4 Mounting speed: 0.06 sec / Chip 0.21sec/Chip Mounting accuracy: ±0.05mm ±0.035mm Number of shelves: *Up to 216 stations (8mm double) shelves Corresponding component size.     0603C/R--L24mm×W24mm     0603C/R--L100mm×W90mm Substrate size: L50mm×W50mm~L510mm×W360mm Features. - Supports a wide range of chip component placement, from 0201 chip to 24mm X 24mm in high-speed machine mode, and from 0201 chip to 90mm X 100mm in multi-function machine mode. - High throughput of 60,000 CPH, the highest in the industry*. - Holds up to 216 types of materials (with 8mm dual shelves) - Standard trolley type one-touch changeover, belt splicing, and continuous replenishment - Board transfer time of 0.9 seconds Flexible board transfer reduces transfer time loss. - User can freely switch between A, B and C production modes on site depending on the production target. Type A High Speed Head + High Speed Head Type B Multifunctional Head + Multifunctional Head (can be equipped with pallet feeder) Type C High-speed Head + Multi-functional Head (can be equipped with pallet feeder) If you want to switch freely between high-speed and multifunctional machines on one bonder, the CM402 with its fast switching platform is the right choice for you. Its high speed mode has a capacity of 60,000 CPH and ±50μm accuracy for substrates up to 18 "x 20". Its multi-function mode also has a capacity of 17,140 CPH and ±35μm accuracy. In addition to high speed and switchability, the CM402 has several other advantages. Its user-friendly interface makes operation and programming easy and simple. It allows for fast substrate transfer and easy product changeover, minimizing production crop losses.