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  • SMT Process Terminology
    SMT Process Terminology
    SMT process terminology 1、Surface mount assembly (SMA) (surface mount assemblys) Surface mount technology is used to complete the mounting of printed board assembly parts. 2、Reflow soldering(reflowsoldering) By melting the solder paste which is pre-distributed to the PCB pads, realize the connection between surface mount components and PCB pads. 3、Wave soldering (wavesoldering) The dissolved solder, through the special equipment spray flow into the design requirements of the solder wave, so that the PCB pre-equipped with electronic components through the solder wave, to achieve the connection between the device and the PCB pads. 4、Fine pitch (finepitch) Less than 0.5mm pin pitch 5、Pin coplanarity ( leadcoplanarity ) Refers to the surface mount component pin vertical height deviation, namely the pin * high foot bottom and * low pin bottom form the plane which between the vertical distance. Its value is generally not greater than 0.1mm. 6、Solder paste (solderpaste) By the powdered solder alloy, flux and some play a sticky role and other role of additives mixed into a certain viscosity and good thixotropy of the solder paste. 7、Curing (curing) In a certain temperature, time conditions, heating the placement of the components of the chip adhesive, in order to make the components and PCB board temporarily fixed together in the process. 8、Patch adhesive or called red glue (adhesives) (SMA) Before curing has a certain initial viscosity has a shape, after curing has sufficient adhesive strength of the gel. 9、dispensing (dispensing) When the surface mount, to the PCB to apply the process of chip adhesive. 10、Dispensing machine (dispenser) Can complete the dispensing operation equipment. 11、Placement (pickandplace) The operation of picking up and placing surface-mounted components from the feeder to the prescribed position on the PCB. 12、Patching machine (placementequipment) Finish surface mount component placement function of special process equipment. 13、 High-speed placement machine (high placement equipment ) The actual placement speed is greater than 20,000 points / hour placement machine. 14、 Multi-function placement machine (multi-function placement equipment ) Used to mount the surface mount device with larger body shape and smaller lead pitch, and requires higher placement accuracy. 15、 Hot air reflow soldering ( hotairreflow soldering ) The reflow soldering which heats up by the forced circulating hot air flow. 16、Patching inspection ( placement inspection ) After the completion of the patching, for whether there is leakage, misalignment, paste the wrong, components damage and other quality inspection. 17、 Stencil printing (metal stencil printing ) The use of stainless steel stencil will be printed on the PCB pad solder paste printing process. 18、 Printing machine (printer) In SMT, stencil printing for special equipment. 19, after the furnace inspection (inspection after soldering ) The quality inspection of the PCBA soldered or cured by the reflow oven after the patching is completed. 20、Inspection before soldering    After the completion of the patch in the reflow oven soldering or curing before the patch quality inspection. 21、Reworking (reworking ) To remove local defects in the PCBA and the repair process. 22, rework station (reworkstation ) Can have quality defects of the PCBA for reworking special equipment.
  • Panasonic mounter MV2VB primary knowledge
    Panasonic mounter MV2VB beginner's knowledge I. Panasonic mounter MV2VB primary education 1. Do not short the safety switch at will 2. Machine failure, must stop to solve 3. Do not look directly at the laser light 4. There are 5 emergency stop switches II. Panasonic mounter MV2VB on/off procedure MAIN CPU ON Computer start up OPERATION READY ON Machine self-test ORG H-axis origin: 64°~74° Home position confirmation: " * " is displayed III. Panasonic mounter MV2VB password setting PASS 1 PASS 2 PANASERT IV. Panasonic mounter MV2VB component naming 1. Axial machine: 26mm, 52mm braided tape. 2. Radial machine: 2.5mm, 5mm braided tape. 3. 3. SMT: Naming the component name with external dimensions. CHIP components: metric 32162125160810050603 imperial 0805060304020201IC Component: DIPSOPQFPBGACSPPLCCLCC pin insertion two sides with feet four sides with feet on the bottom of the piece (ball type) pin inward curved side with feet V. Panasonic mounter MV2VB installation precautions 1. power supply: AC200V ± 5%, three-phase four-wire system. 2. single-phase power supply: AC100V±5%. 3. compressed air > 0.49MPa ≈ 5KP/cm2. 4. Working ambient temperature: 20℃±10℃. VI. Panasonic placement machine MV2VB machine main unit introduction 1. 12 rotating working head (difference: high-speed machine TABLE moving, medium-speed machine HEAD moving) 2. LOADER/UNLOADER3. unit HEAD of the working head4. FEEDER CARRIAGE5. material frame single: K, QTYPE double: K, Q TYPE 8 × 2 plastic handle = black 8 × 4 plastic handle = white 8 × 4 plastic handle = green material frame fixed way: "K" TYPEPITCH 21.5mm single shelf 21.50mm double shelf 10.75mm "Q" TYPEPITCH 20.0mm single shelf 20.00mm double shelf 10.00mm *Size of the machine: M 330×250 PCB size * large 50×50 PCB size * Small XL 510×450 PCB size*Large 50×50 PCB size*Small VII. The principle of Panasonic mounter MV2VB. 1 position: Vacuum valve open (VS), feeding mechanism, suction height compensation (VT), large part detection, cutter, PUSH UP PIN (K: Yes Q: No). 2 positions: Θ1 coarse adjustment: 0° 90° 180° 270° 4 angles 3 bits: Detects the presence of components and determines the component thickness. 4 bits: Reflection and transmission identification. (CT) High density placement, component gap ≤ 0.2mm, component position on the nozzle offset, easy to hit the component when posting. With SHUTTER. component bigger, SHUTTER off, form total reflection. mv2fmv2vb relative transmittance light source (halogen lamp) normally bright uncontrolled controllable reflective plate white orange reflective light source (LED) red orchid 5 bits: empty. 6 position: Θ2 Fine adjustment: < 90° rotation range. 7 position: Mechanical valve control (suction, blowing) Action: blow valve open (MS), placement height compensation (MT). panasert height compensation standard: overfill 0.2mm. 8 position: empty. 9 position: nozzle type detection and throwing. 10 position: Nozzle selection execution. (NS) 11 bit: Nozzle selection detection. 12 bits: Θ3 Nozzle home position. VIII. Z-axis operation mode (75+75) 1. Part type > 75 can be connected 2. Part type < 75 can be used in exchange/priority exchange/preparation (fixed) mode IX. CAMERA specifications PCB CAMERA: 6mm×6mm Part identification camera: 1. Small field of view camera 6mm×6mm 2. Large field of view camera 20mm×20mm PITCH = 0.50mm 32mm×32mm PITCH = 0.65mm X. Program tolerance number NC program: 200 PCS (5000 STEPS/1 program) A RRAY program: 200 PCS MARK program: 500 PCS PCB program: 200 PCS PARTS program: 1000 PCS XI. Production product switching 1. Machine back to ORG 2. Remove all SUPPORT PINs on X-Y TABLE 3. Select program SETUP: NC, ARRAY, PCB; production condition: OK 4. Adjust PCB STOPPER, POSITION PIN 5. Install SUPPORT PIN 6. Confirm STOPPER, POSITION PIN by SEMI LOADING 7. AUTO RUN XII. Panasonic placement machine MV2VB working environment 1. Ambient temperature: 20 ± 10 degrees Celsius 2. Working pressure: 0.49Mpa 3. Placement speed: 0.1 second (8MM braided tape XY TABLE moving distance <15MM FEEDER fixed) 4. Placement angle: 0°~ 359.99° 5. control part: use semi-closed loop control AC SERVO MOTOR; pulse motor open loop 6. Placement range: MAX: 330*242 MIN: 50*42 7. Processing PCB size: MAX: 330*250 MIN: 50*50 8. PCB transfer time: 2.4 seconds 9. PCB program editing: Input the actual width of PCB board 10. Material station: 75 + 7511. Flow rate: 0.1 m3/min XIII. NC program preparation BLOCK: Program line number X, Y: POSITION Z No: station number S S: The function of piecing the board, consisting of 2 digits: Decimal: 0 - pan 1 - 90 degrees clockwise 2 - 180 degrees clockwise 3 - 270 degrees clockwise   Digit: 0 - no repeat; 1 - step repeat; 2 - graphic repeat θ: rotation angle  MOUNT NO: Whether to mount or not to mount Select 0 - mount 1 - no mount SKIP: Conditional jump code: 1 to 6, 8, 9 Unconditional code: 7 No jump: 0 MARK: 0 - No MARK 1 - Component MARK 2 - PCB MARK 3 - Patchwork MARK  LND: 0 - no pad show 1 - pad show BAD MAR
  • SMT Process Introduction
    SMT Process Introduction Types of SMT processes Type I Assembly with surface mount components only  IA single-sided assembly with surface mount only  Process:Silkscreen solder paste=>Mounted components=>Reflow soldering  IB only surface mount double-sided assembly  Sequence:Silkscreen solder paste=>Placement component=>Reflow soldering=>Reverse side=>Silkscreen solder paste=>Placement component=>Reflow soldering The second type of assembly using surface mount components on one side and surface mount components mixed with perforated components on the other side   Process: silkscreen solder paste (top side) => mount components => reflow soldering => reverse side => spot glue (bottom side) => mount components => drying glue => reverse side => insert components => wave soldering The third type of top surface using perforated components, bottom surface using surface mount components assembly  Process: Dispensing=>Placement component=>Drying adhesive=>Reverse side=>Insert component=>Wave soldering   Receive PCB, placement components Placement program entry, track adjustment, furnace temperature adjustment Loading PCB       Dispensing (printing) Lamination Inspection Curing Inspection Packaging Custody   Process requirements and characteristics of each process.   1. Preparation before production l Clear the product model, PCB version number, production quantity and batch number. l Clear the type, quantity, specification and substitute material of components. l Clear the name of SMD, dispensing, printing program. l Clear Feeder list. l Have production operation instruction card and clear instruction card content.  2. Requirements for machine changeover l Make sure the machine program is correct. l Make sure the components of each feeder position correspond to the feeder list. l Make sure all track widths and positioning pins are in the correct position. l Make sure all feeders are properly and securely mounted on the table. l Verify that all feeders have the correct feeder spacing. l Make sure that the upper and lower plates of the machine are not smooth. l Check if the dispensing volume, size, height and position are suitable. l Check whether the amount, height and position of printed solder paste are suitable. l Check whether the placement component and position are correct. l Check whether air bubbles are generated after curing or reflow.
  • Dispensing process requirements and characteristics
    Dispensing process requirements and characteristics Dispensing process requirements and characteristics. Dispensing process is mainly used for lead components through-hole insertion (THT) and surface mount (SMT) coexistence of paste insertion mixed assembly process. In the entire production process (see figure), we can see that the printed circuit board (PCB) one side of the components from the beginning of the dispensing curing, to the end to wave soldering welding, which is a long interval, and carry out other processes more, the curing of components is particularly important. PCB point B side --- SMD B side --- reflow curing --- screen printing A side --- SMD A side --- reflow soldering --- automatic insertion --- manual flow insertion --- wave soldering B side Process control in the dispensing process. Production is prone to the following process defects: the size of the glue dot is not qualified, drawing, glue dipping pads, curing strength is not good easy to fall out of the film, etc.. Therefore, the control of the technical parameters of the dispensing process is the solution to the problem.   The size of the dispensing volume according to work experience. The size of the diameter of the glue dot should be half of the pad spacing, the diameter of the glue dot after the patch should be 1.5 times the diameter of the glue dot. This will ensure that there is sufficient glue to bond the components and avoid too much glue soaked pads. How much glue is dispensed by the dispensing time and the amount of glue to decide, the actual production situation should be based on (room temperature, the viscosity of the glue, etc.) to choose the dispensing parameters. Dispensing pressure Currently. The dispensing machine uses a pressure to the dispensing needle barrel to ensure enough glue to squeeze out the dispensing nozzle. Too much pressure can easily cause too much glue; too little pressure can cause intermittent dispensing and leakage, thus causing defects. The pressure should be selected according to the quality of the glue and the temperature of the working environment. If the ambient temperature is high, the glue viscosity will become smaller and the liquidity will become better, then the pressure should be lowered to ensure the glue supply, and vice versa. Dispensing nozzle size in the actual work. The size of the inner diameter of the dispensing nozzle should be the diameter of the glue dot 1/2, dispensing process, the size of the pads on the PCB should be selected according to the size of the dispensing nozzle: such as 0805 and 1206 pads are not very different in size, you can choose the same needle, but for the difference between the pads should choose a different dispensing nozzle, so that you can ensure the quality of the glue, but also improve production efficiency. The distance between the dispensing nozzle and the PCB board is different. The dispensing machine using different needles, the dispensing nozzle has a certain degree of stopping. Each work should be started to ensure that the stop lever of the dispensing nozzle touches the PCB. Glue temperature. General epoxy resin glue should be kept in the refrigerator at 0 - 50C, and should be taken out 1/2 hour in advance when using to make the glue fully compatible with the working temperature. The use temperature of glue should be 230C--250C; the ambient temperature has a great influence on the viscosity of glue, the temperature is too low then the glue point will become smaller and the phenomenon of drawing will appear. A difference of 50C in ambient temperature will cause 50% change in the amount of glue dispensed. Therefore, the ambient temperature should be controlled. At the same time, the temperature of the environment should also be given to ensure that the humidity is small, the glue point is easy to become dry, affecting the bonding force. Viscosity of glue. The viscosity of glue directly affects the quality of dispensing. If the viscosity is large, the glue point will become small and even draw; if the viscosity is small, the glue point will become large and then may bleed pad. In the process of dispensing, a reasonable pressure and dispensing speed should be selected for different viscosity of glue. Curing temperature curve For the curing of the glue. The manufacturer has generally given the temperature curve. In practice, a higher temperature should be used as far as possible. In practice, the glue should be cured at a higher temperature as possible, so that the glue has sufficient strength after curing. Air bubbles The glue must not have air bubbles. A small bubble will cause many pads without glue; each time the glue should be filled with air in the bottle to prevent the phenomenon of empty play. For the adjustment of the above parameters, should be according to the point and the way, any change in any one parameter will affect other aspects, while the defects may be caused by multiple aspects, should be possible factors to chec
  • "Ning Wang" build a factory in North America, domestic battery companies exports overseas faster
           Jiwei.com reported that in the first wave of fuel car electrification transition, domestic battery companies along with the market explosion successfully among the global first echelon, growing up such as Ningde Time, BYD and other leading global enterprises.   At the same time of the rapid development of Chinese battery enterprises, the demand for power batteries and energy storage in overseas markets is also intensifying, and there is a huge market gap. At the same time, with the withdrawal of "national subsidies", the domestic new energy market is tilted from policy-driven to market-led, and competition is becoming increasingly fierce, so "going out" has become a natural choice for battery companies.   Recently, Ningde Times officially announced that it will cooperate with Ford to produce batteries in the United States. As a battery brother, Ningde Times to enter the North American market, or further drive the speed of domestic battery companies to the sea.   After entering Europe, Ningde Times finally set foot on North America.   After more than three years, at the end of December last year, Ningde Time's first overseas factory in Thuringia, Germany, was put into operation as scheduled for lithium-ion battery cells. With a total investment of 1.8 billion euros and a planned production capacity of 14 GWh, this is Ningde Times' first battery factory in Europe and its first factory outside China.         After the successful construction of the first battery factory, Ningde Times started to plan its second factory in Europe. last August, Ningde Times announced that it would build its second battery factory in Europe in Hungary with an investment of 7.34 billion euros and a planned capacity of 100 GWh. the factory is expected to start construction in the second half of this year and aims to become the largest power battery factory in Europe.        The reason why Ningde Times is willing to make a big investment in Europe to build a plant is inseparable from its on-hand fixed-point projects and target customers at that time. As early as from 2018 to 2019, Ningde Times had intensively obtained fixed-point projects or intended orders from overseas first-class car companies, for example, Daimler, Peugeot Citroen, BMW and so on. After this new plant of Ningde Times in Germany is put into operation, it will be able to supply batteries from local to BMW, Bosch, Daimler and other European automakers, eliminating long-distance shipping from China to Europe.        Outside of Europe, North America, where the electric vehicle market is starting to climb rapidly, is of course an important market for Ningde Times to focus on, as rumors of a North American plant have reversed several times before this. on February 14, Ningde Times finally made an official announcement, confirming that it will cooperate with Ford to produce batteries in the United States.   According to the agreement, Ningde Times will provide construction and operation services for Ford's battery plant in Michigan and license the battery patent technology. The plant, which is wholly owned by Ford, is expected to be put into operation in 2026 with an annual capacity of about 35 GWh, providing power cells for about 400,000 Ford electric vehicles per year.   It is reported that Ford and Ningde Time cooperation of this plant will be the first lithium iron phosphate battery plant in the United States. Compared to ternary lithium batteries, lithium iron phosphate batteries are lower cost and more secure. Ford said that the new plant's battery will be one of the lowest cost of production batteries, will help reduce the pricing of electric vehicles.   Industry analysts pointed out that the introduction of the U.S. "Inflation Reduction Act", so that the domestic manufacture of batteries in the United States more cost advantage. The bill provides that EV companies that manufacture and assemble batteries in the U.S. can offset more than one-third of the total cost of the batteries with subsidies they receive.   For car companies, the whole vehicle cost accounted for nearly half of the battery price, if it can be reduced, will undoubtedly help to improve the gross profit level of car companies, enhance the competitiveness of enterprises.   2022 U.S. new energy vehicle sales show that after Tesla, Ford jumped to second place in electric vehicle sales, with a 7.6% share of the all-electric vehicle market in the United States. With Ningde Time's advanced battery technology, Ford is expected to meet the challenges of competitors such as Tesla by reducing production costs.   And Ford's upside in the field of electric vehicles will naturally help Ningde Times to expand the North American market. The North American market, which has previously been dominated by Japanese and Korean battery companies, has finally been taken by Ningde Time. Seize the overseas market gap, domestic battery companies to accelerate the sea   Compared with the fully competi


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