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SMT's basic requirements for bonding glue

SMT's basic requirements for bonding glue

  • Categories:Industry News
  • Author:Becky Su
  • Origin:
  • Time of issue:2023-02-08 11:14
  • Views:

(Summary description)SMT's basic requirements for bonding glue l No impurities and air bubbles in the package l Long storage period l Can be used in high speed / or super high speed dispensing machines l Consistent glue dot shape and volume High dot cross-section, no pulling Easy to identify the color, easy to check the quality of glue dots by manual and automatic machines l High initial adhesive force High speed curing, low curing temperature of glue, short curing time l No collapse of glue dots during heat curing High strength and elasticity to resist sudden temperature changes during wave soldering Excellent electrical properties after curing l Non-toxic Good rework characteristics Production quality problems caused by SMD adhesive l Missing parts (with and without SMD glue traces) l Component skew l contact problems (pulling, too much SMD adhesive) SMD adhesive use specifications. l storage Glue ** should be registered after the arrival time, expiration date, model, and for each bottle of glue number. Then keep the glue in a constant temperature and humidity refrigerator at (1-10)℃. l Access When glue is used, it should be done on the principle of first-in, first-out. It should be taken out from the refrigerator at least one hour in advance, write down the time, number, user, and product applied, and put it in the room temperature under the seal. When the glue reaches the room temperature, the glue should be injected into the dispensing bottles respectively with the glue injection gun according to the usage amount of **. When injecting glue, fill the dispensing bottle carefully and slowly to prevent air bubbles. l Use Put the glue bottle back into the refrigerator, and take it out from the refrigerator 0.5~2.0 hours before production, mark the time, date and bottle number, fill in the record sheet of glue (solder paste) thawing and using time, clean the used glue bottle with alcohol or acetone and put it away for the next use, and put the unused glue into the refrigerator for storage with the marked time.

SMT's basic requirements for bonding glue

(Summary description)SMT's basic requirements for bonding glue

l No impurities and air bubbles in the package
l Long storage period
l Can be used in high speed / or super high speed dispensing machines
l Consistent glue dot shape and volume
High dot cross-section, no pulling
Easy to identify the color, easy to check the quality of glue dots by manual and automatic machines
l High initial adhesive force
High speed curing, low curing temperature of glue, short curing time
l No collapse of glue dots during heat curing
High strength and elasticity to resist sudden temperature changes during wave soldering
Excellent electrical properties after curing
l Non-toxic
Good rework characteristics
Production quality problems caused by SMD adhesive
l Missing parts (with and without SMD glue traces)
l Component skew
l contact problems (pulling, too much SMD adhesive)
SMD adhesive use specifications.
l storage
Glue ** should be registered after the arrival time, expiration date, model, and for each bottle of glue number. Then keep the glue in a constant temperature and humidity refrigerator at (1-10)℃.
l Access
When glue is used, it should be done on the principle of first-in, first-out. It should be taken out from the refrigerator at least one hour in advance, write down the time, number, user, and product applied, and put it in the room temperature under the seal. When the glue reaches the room temperature, the glue should be injected into the dispensing bottles respectively with the glue injection gun according to the usage amount of **. When injecting glue, fill the dispensing bottle carefully and slowly to prevent air bubbles.
l Use
Put the glue bottle back into the refrigerator, and take it out from the refrigerator 0.5~2.0 hours before production, mark the time, date and bottle number, fill in the record sheet of glue (solder paste) thawing and using time, clean the used glue bottle with alcohol or acetone and put it away for the next use, and put the unused glue into the refrigerator for storage with the marked time.

  • Categories:Industry News
  • Author:Becky Su
  • Origin:
  • Time of issue:2023-02-08 11:14
  • Views:
Information

SMT's basic requirements for bonding glue

l No impurities and air bubbles in the package
l Long storage period
l Can be used in high speed / or super high speed dispensing machines
l Consistent glue dot shape and volume
High dot cross-section, no pulling
Easy to identify the color, easy to check the quality of glue dots by manual and automatic machines
l High initial adhesive force
High speed curing, low curing temperature of glue, short curing time
l No collapse of glue dots during heat curing
High strength and elasticity to resist sudden temperature changes during wave soldering
Excellent electrical properties after curing
l Non-toxic
Good rework characteristics
Production quality problems caused by SMD adhesive
l Missing parts (with and without SMD glue traces)
l Component skew
l contact problems (pulling, too much SMD adhesive)
SMD adhesive use specifications.
l storage
Glue ** should be registered after the arrival time, expiration date, model, and for each bottle of glue number. Then keep the glue in a constant temperature and humidity refrigerator at (1-10)℃.
l Access
When glue is used, it should be done on the principle of first-in, first-out. It should be taken out from the refrigerator at least one hour in advance, write down the time, number, user, and product applied, and put it in the room temperature under the seal. When the glue reaches the room temperature, the glue should be injected into the dispensing bottles respectively with the glue injection gun according to the usage amount of **. When injecting glue, fill the dispensing bottle carefully and slowly to prevent air bubbles.
l Use
Put the glue bottle back into the refrigerator, and take it out from the refrigerator 0.5~2.0 hours before production, mark the time, date and bottle number, fill in the record sheet of glue (solder paste) thawing and using time, clean the used glue bottle with alcohol or acetone and put it away for the next use, and put the unused glue into the refrigerator for storage with the marked time.

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