SMT Process Introduction Types of SMT processes Type I Assembly with surface mount components only  IA single-sided assembly with surface mount only  Process:Silkscreen solder paste=>Mounted components=>Reflow soldering  IB only surface mount double-sided assembly  Sequence:Silkscreen solder paste=>Placement component=>Reflow soldering=>Reverse side=>Silkscreen solder paste=>Placement component=>Reflow soldering The second type of assembly using surface mount components on one side and surface mount components mixed with perforated components on the other side   Process: silkscreen solder paste (top side) => mount components => reflow soldering => reverse side => spot glue (bottom side) => mount components => drying glue => reverse side => insert components => wave soldering The third type of top surface using perforated components, bottom surface using surface mount components assembly  Process: Dispensing=>Placement component=>Drying adhesive=>Reverse side=>Insert component=>Wave soldering   Receive PCB, placement components Placement program entry, track adjustment, furnace temperature adjustment Loading PCB       Dispensing (printing) Lamination Inspection Curing Inspection Packaging Custody   Process requirements and characteristics of each process.   1. Preparation before production l Clear the product model, PCB version number, production quantity and batch number. l Clear the type, quantity, specification and substitute material of components. l Clear the name of SMD, dispensing, printing program. l Clear Feeder list. l Have production operation instruction card and clear instruction card content.  2. Requirements for machine changeover l Make sure the machine program is correct. l Make sure the components of each feeder position correspond to the feeder list. l Make sure all track widths and positioning pins are in the correct position. l Make sure all feeders are properly and securely mounted on the table. l Verify that all feeders have the correct feeder spacing. l Make sure that the upper and lower plates of the machine are not smooth. l Check if the dispensing volume, size, height and position are suitable. l Check whether the amount, height and position of printed solder paste are suitable. l Check whether the placement component and position are correct. l Check whether air bubbles are generated after curing or reflow.

SMT Process Introduction

Types of SMT processes

Type I Assembly with surface mount components only
 IA single-sided assembly with surface mount only
 Process:Silkscreen solder paste=>Mounted components=>Reflow soldering
 IB only surface mount double-sided assembly
 Sequence:Silkscreen solder paste=>Placement component=>Reflow soldering=>Reverse side=>Silkscreen solder paste=>Placement component=>Reflow soldering
The second type of assembly using surface mount components on one side and surface mount components mixed with perforated components on the other side
  Process: silkscreen solder paste (top side) => mount components => reflow soldering => reverse side => spot glue (bottom side) => mount components => drying glue => reverse side => insert components => wave soldering
The third type of top surface using perforated components, bottom surface using surface mount components assembly
 Process: Dispensing=>Placement component=>Drying adhesive=>Reverse side=>Insert component=>Wave soldering
  Receive PCB, placement components Placement program entry, track adjustment, furnace temperature adjustment Loading PCB
      Dispensing (printing) Lamination Inspection Curing Inspection Packaging Custody
 
Process requirements and characteristics of each process.
  1. Preparation before production
l Clear the product model, PCB version number, production quantity and batch number.
l Clear the type, quantity, specification and substitute material of components.
l Clear the name of SMD, dispensing, printing program.
l Clear Feeder list.
l Have production operation instruction card and clear instruction card content.
 2. Requirements for machine changeover
l Make sure the machine program is correct.
l Make sure the components of each feeder position correspond to the feeder list.
l Make sure all track widths and positioning pins are in the correct position.
l Make sure all feeders are properly and securely mounted on the table.
l Verify that all feeders have the correct feeder spacing.
l Make sure that the upper and lower plates of the machine are not smooth.
l Check if the dispensing volume, size, height and position are suitable.
l Check whether the amount, height and position of printed solder paste are suitable.
l Check whether the placement component and position are correct.
l Check whether air bubbles are generated after curing or reflow.