SMT Basics knowledage Features of SMT 1. High assembly density, small size and light weight of electronic products, the volume and weight of SMD components is only about 1/10 of traditional cartridge components, generally after the use of SMT, electronic products volume reduction of 40% to 60%, weight reduction of 60% to 80%. 2. High reliability, strong resistance to vibration. Low defect rate of solder joints. 3. 3. Good high frequency characteristics. Reduced electromagnetic and radio frequency interference. Easy to automate and improve production efficiency. Reduces costs by up to 30% to 50%. Saves material, energy, equipment, manpower, time, etc. Why use surface mount technology (SMT) 1. Electronic products pursue miniaturisation, the previously used perforated insert components can no longer be reduced in size 2. electronic products more complete function, the integrated circuit (IC) used has no perforated components, especially large-scale, highly integrated IC, had to use surface mount components 3. product batching, production automation, the factory must be low cost and high yield, production of superior products to meet customer demand and strengthen market competitiveness 4. development of electronic components, integrated circuits (ICs) and diversified applications of semiconductor materials

SMT Basics knowledage

Features of SMT
1. High assembly density, small size and light weight of electronic products, the volume and weight of SMD components is only about 1/10 of traditional cartridge components, generally after the use of SMT, electronic products volume reduction of 40% to 60%, weight reduction of 60% to 80%.
2. High reliability, strong resistance to vibration. Low defect rate of solder joints. 3.
3. Good high frequency characteristics. Reduced electromagnetic and radio frequency interference.
Easy to automate and improve production efficiency. Reduces costs by up to 30% to 50%. Saves material, energy, equipment, manpower, time, etc.
Why use surface mount technology (SMT)
1. Electronic products pursue miniaturisation, the previously used perforated insert components can no longer be reduced in size
2. electronic products more complete function, the integrated circuit (IC) used has no perforated components, especially large-scale, highly integrated IC, had to use surface mount components
3. product batching, production automation, the factory must be low cost and high yield, production of superior products to meet customer demand and strengthen market competitiveness
4. development of electronic components, integrated circuits (ICs) and diversified applications of semiconductor materials