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SMT chip part of the component interpretation

SMT chip part of the component interpretation

  • Categories:Industry News
  • Author:Becky Su
  • Origin:
  • Time of issue:2023-11-04 10:38
  • Views:

(Summary description)SMT chip part of the component interpretation Diode    A, from the package material can be divided into glass diodes, plastic diodes;    B. From the semiconductor material: can be divided into germanium material diode, silicon material diode.        From the function points: switching diodes, rectifier diodes, light-emitting diodes.    C. The characteristics of different semiconductor materials are different.         Germanium diodes, rectifier diodes, light-emitting diodes are mostly silicon diodes.        tube, general germanium diode using glass package, silicon diode using plastic.    D, diodes have polarity distinction, the negative pole of the general diode with white, red or black ** ring marking.       The negative terminal of a diode is marked with a white, red or black ring, and light-emitting diodes generally use different pin lengths to distinguish polarity.       Light-emitting diodes generally use different lengths of the pins to distinguish polarity, the shorter pins for the negative pole    Triode Triode classification according to the triode process can be divided into NPN tube, PNP tube, MOS tube. Integrated Circuit (IC) IC classification is mainly based on the IC package form, can be basically divided into: SOJ (double-row inner J-shaped), PLCC (quadrilateral J-shaped pins), QFP (quadrilateral) BGA (the bottom of the ball-shaped form) three forms.    A, SOJ package IC (double-row in-line J-shaped inside)          SOJ IC (double-row in-line), IC screen printing surface with the model number screen printing, the direction of the instruction notch, the first foot instruction mark.    B, PLCC (quadrilateral J-shaped pin)      Internationally adopted IC foot position of the unified standard: the direction of the IC notch towards the left, close to their own side of the pin from left to right for the first foot to the Nth foot, away from their own side from right to left for the N + 1 foot to the last foot. Note: Some manufacturers produce ICs that are not marked with a notch to indicate the direction, but with a silkscreen to indicate the direction of the identification of the pin position and the same method as described above.    C. QFP (Quadrilateral Finned Pin)       QFPIC package: In the integrated circuit of the amount of integration and the increase in functionality at the same time, IC pins continue to increase, while the volume of the IC can not be increased too much, so the IC to solve this contradiction in the design of the four sides of the pins have a positive quadrilateral IC package form.     Positive quadrilateral IC pin pin identification method: the direction of the indicator mark towards the left and close to their own, facing their own row of pins on the left side of the first pin for the first IC foot, according to the counterclockwise direction in turn for the second foot to the Nth foot.    D. BGA (Bottom Gland Assembly)      BGA package: With the technological update of the integration of integrated circuits continue to improve, powerful IC continues to be designed, the pin continues to increase the QFP way can not solve the demand, so the BGA package was designed to take full advantage of the IC and PCB contact area, significant use of the IC's bottom and vertical soldering method, thus solving the problem of the pin! Crystal Vibrator   A crystal oscillator is an electronic component that generates a fixed frequency through a certain voltage excitation, and is widely used in home appliances, instruments and computers.   There are two types of crystals: passive crystals and active crystals. Passive crystal oscillator is generally only two pins, active crystal oscillator is generally four pins, and in the insertion of the corresponding feet have strict requirements, if inserted in the opposite direction will be crystal damage. (At the same time, the chip crystal vibration membrane is very thin, pick up when you want to take lightly put). Optocoupler identification   Mainly: SMD optocoupler, hand-inserted optocoupler. The difference between IC and IC is that IC generally have 8 or more than 8 pins, while the optocoupler is generally 4 to 6 feet. Socket   Socket in electronic instruments, equipment, household appliances and other electronic products are widely used, play a role in connection. Is the modularization of electronic products, and more convenient to update, maintenance.   Socket: The direction of the socket is indicated by some special attachment number or component notch.

SMT chip part of the component interpretation

(Summary description)SMT chip part of the component interpretation

Diode
   A, from the package material can be divided into glass diodes, plastic diodes;
   B. From the semiconductor material: can be divided into germanium material diode, silicon material diode.
       From the function points: switching diodes, rectifier diodes, light-emitting diodes.
   C. The characteristics of different semiconductor materials are different.
        Germanium diodes, rectifier diodes, light-emitting diodes are mostly silicon diodes.
       tube, general germanium diode using glass package, silicon diode using plastic.
   D, diodes have polarity distinction, the negative pole of the general diode with white, red or black ** ring marking.
      The negative terminal of a diode is marked with a white, red or black ring, and light-emitting diodes generally use different pin lengths to distinguish polarity.
      Light-emitting diodes generally use different lengths of the pins to distinguish polarity, the shorter pins for the negative pole   

Triode
Triode classification according to the triode process can be divided into NPN tube, PNP tube, MOS tube.

Integrated Circuit (IC)
IC classification is mainly based on the IC package form, can be basically divided into: SOJ (double-row inner J-shaped), PLCC (quadrilateral J-shaped pins), QFP (quadrilateral) BGA (the bottom of the ball-shaped form) three forms.
   A, SOJ package IC (double-row in-line J-shaped inside)  
       SOJ IC (double-row in-line), IC screen printing surface with the model number screen printing, the direction of the instruction notch, the first foot instruction mark.
   B, PLCC (quadrilateral J-shaped pin)
     Internationally adopted IC foot position of the unified standard: the direction of the IC notch towards the left, close to their own side of the pin from left to right for the first foot to the Nth foot, away from their own side from right to left for the N + 1 foot to the last foot. Note: Some manufacturers produce ICs that are not marked with a notch to indicate the direction, but with a silkscreen to indicate the direction of the identification of the pin position and the same method as described above.
   C. QFP (Quadrilateral Finned Pin)
      QFPIC package: In the integrated circuit of the amount of integration and the increase in functionality at the same time, IC pins continue to increase, while the volume of the IC can not be increased too much, so the IC to solve this contradiction in the design of the four sides of the pins have a positive quadrilateral IC package form.
    Positive quadrilateral IC pin pin identification method: the direction of the indicator mark towards the left and close to their own, facing their own row of pins on the left side of the first pin for the first IC foot, according to the counterclockwise direction in turn for the second foot to the Nth foot.
   D. BGA (Bottom Gland Assembly)
     BGA package: With the technological update of the integration of integrated circuits continue to improve, powerful IC continues to be designed, the pin continues to increase the QFP way can not solve the demand, so the BGA package was designed to take full advantage of the IC and PCB contact area, significant use of the IC's bottom and vertical soldering method, thus solving the problem of the pin!

Crystal Vibrator
  A crystal oscillator is an electronic component that generates a fixed frequency through a certain voltage excitation, and is widely used in home appliances, instruments and computers.
  There are two types of crystals: passive crystals and active crystals. Passive crystal oscillator is generally only two pins, active crystal oscillator is generally four pins, and in the insertion of the corresponding feet have strict requirements, if inserted in the opposite direction will be crystal damage. (At the same time, the chip crystal vibration membrane is very thin, pick up when you want to take lightly put).

Optocoupler identification
  Mainly: SMD optocoupler, hand-inserted optocoupler. The difference between IC and IC is that IC generally have 8 or more than 8 pins, while the optocoupler is generally 4 to 6 feet.

Socket
  Socket in electronic instruments, equipment, household appliances and other electronic products are widely used, play a role in connection. Is the modularization of electronic products, and more convenient to update, maintenance.
  Socket: The direction of the socket is indicated by some special attachment number or component notch.

  • Categories:Industry News
  • Author:Becky Su
  • Origin:
  • Time of issue:2023-11-04 10:38
  • Views:
Information

SMT chip part of the component interpretation

Diode
   A, from the package material can be divided into glass diodes, plastic diodes;
   B. From the semiconductor material: can be divided into germanium material diode, silicon material diode.
       From the function points: switching diodes, rectifier diodes, light-emitting diodes.
   C. The characteristics of different semiconductor materials are different.
        Germanium diodes, rectifier diodes, light-emitting diodes are mostly silicon diodes.
       tube, general germanium diode using glass package, silicon diode using plastic.
   D, diodes have polarity distinction, the negative pole of the general diode with white, red or black ** ring marking.
      The negative terminal of a diode is marked with a white, red or black ring, and light-emitting diodes generally use different pin lengths to distinguish polarity.
      Light-emitting diodes generally use different lengths of the pins to distinguish polarity, the shorter pins for the negative pole   

Triode
Triode classification according to the triode process can be divided into NPN tube, PNP tube, MOS tube.

Integrated Circuit (IC)
IC classification is mainly based on the IC package form, can be basically divided into: SOJ (double-row inner J-shaped), PLCC (quadrilateral J-shaped pins), QFP (quadrilateral) BGA (the bottom of the ball-shaped form) three forms.
   A, SOJ package IC (double-row in-line J-shaped inside)  
       SOJ IC (double-row in-line), IC screen printing surface with the model number screen printing, the direction of the instruction notch, the first foot instruction mark.
   B, PLCC (quadrilateral J-shaped pin)
     Internationally adopted IC foot position of the unified standard: the direction of the IC notch towards the left, close to their own side of the pin from left to right for the first foot to the Nth foot, away from their own side from right to left for the N + 1 foot to the last foot. Note: Some manufacturers produce ICs that are not marked with a notch to indicate the direction, but with a silkscreen to indicate the direction of the identification of the pin position and the same method as described above.
   C. QFP (Quadrilateral Finned Pin)
      QFPIC package: In the integrated circuit of the amount of integration and the increase in functionality at the same time, IC pins continue to increase, while the volume of the IC can not be increased too much, so the IC to solve this contradiction in the design of the four sides of the pins have a positive quadrilateral IC package form.
    Positive quadrilateral IC pin pin identification method: the direction of the indicator mark towards the left and close to their own, facing their own row of pins on the left side of the first pin for the first IC foot, according to the counterclockwise direction in turn for the second foot to the Nth foot.
   D. BGA (Bottom Gland Assembly)
     BGA package: With the technological update of the integration of integrated circuits continue to improve, powerful IC continues to be designed, the pin continues to increase the QFP way can not solve the demand, so the BGA package was designed to take full advantage of the IC and PCB contact area, significant use of the IC's bottom and vertical soldering method, thus solving the problem of the pin!

Crystal Vibrator
  A crystal oscillator is an electronic component that generates a fixed frequency through a certain voltage excitation, and is widely used in home appliances, instruments and computers.
  There are two types of crystals: passive crystals and active crystals. Passive crystal oscillator is generally only two pins, active crystal oscillator is generally four pins, and in the insertion of the corresponding feet have strict requirements, if inserted in the opposite direction will be crystal damage. (At the same time, the chip crystal vibration membrane is very thin, pick up when you want to take lightly put).

Optocoupler identification
  Mainly: SMD optocoupler, hand-inserted optocoupler. The difference between IC and IC is that IC generally have 8 or more than 8 pins, while the optocoupler is generally 4 to 6 feet.

Socket
  Socket in electronic instruments, equipment, household appliances and other electronic products are widely used, play a role in connection. Is the modularization of electronic products, and more convenient to update, maintenance.
  Socket: The direction of the socket is indicated by some special attachment number or component notch.

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