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Electroplating process and role

Electroplating process and role

  • Categories:Industry News
  • Author:Becky Su
  • Origin:
  • Time of issue:2023-05-27 11:04
  • Views:

(Summary description)Electroplating process and role Acid dip: the main role is to remove the oxide layer on the board surface, to avoid water brought into the copper cylinder and affect the content of sulphuric acid. Cleaner: This cleaner is acidic and its main function is to remove fingerprints, grease and other residues from the surface of the board to keep it clean. Therefore, the grease, fingerprints should be prevented as a priority: and must pay attention to the compatibility of the resist layer and the matching between other fluids in the same line, and reduce the surface tension, the ability to exclude air bubbles in the hole. Micro-etching: As all kinds of dry film resist have additives to promote adhesion deep into the copper layer, 20~50u" of copper should be removed in this step to ensure a fresh copper layer to obtain good adhesion. Washing: The main function is to wash the residual solution from the board surface and the holes. Copper plating: The main components of the copper plating solution are copper sulphate, sulphuric acid, chloride ions, contaminants and other additives. Their respective roles are as follows: Copper sulphate: to provide the basic conductive copper ions required for plating to occur, the concentration is too high, although the operating current density can be slightly higher than the upper limit, but due to the concentration gradient difference is large, easy to cause Throwingpower**, and copper ions are too low, because the deposition rate is easily greater than the speed of diffusion movement, resulting in hydrogen ion reduction and the formation of scorching. Sulphuric acid: To provide a conductive acid ion to the bath. The ratio of sulphuric acid to copper is usually considered as "18g/l of copper metal + 180g/l of sulphuric acid" to maintain the acid to copper ratio above 10/1, 12:1 is better, ** not less than 6:1, high acid and low copper amount is prone to scorching, while low acid and high copper is not conducive to ThrowingPower. Chlorine ion: Its function is twofold, to help dissolve the anode properly and to help other additives to form a glossy effect, but too much chlorine ion will easily cause polarisation of the anode. Insufficient chloride ions can lead to abnormal consumption of other additives and imbalances in the bath (even fog deposition or step plating at very high levels; levelling** at too low levels). Other additives: The combined function of all other organic additives can achieve a regular crystalline arrangement of the lustre effect and improve the physical strength of the plating, while a relative excess of additives can easily cause the decomposition and oxidation of organic matter, pollution of the bath, increase in the frequency of activated carbon treatment, or an increase in the co-precipitation ratio of organic matter, resulting in increased internal stress and reduced ductility of the plating. Pollutants: Organic and inorganic pollutants can be distinguished, as the destruction of the equiaxial crystalline structure causes physical deterioration and co-precipitation causes deterioration in appearance. The sources of organic contamination are: oxidative decomposition of lustre agents, inks, dry films, baths, filters, anode bags, hanger cladding films and other filtered out substances and environmental pollutants. The sources of inorganic pollution are: environmental pollution, water pollution and basic material pollution.

Electroplating process and role

(Summary description)Electroplating process and role

Acid dip: the main role is to remove the oxide layer on the board surface, to avoid water brought into the copper cylinder and affect the content of sulphuric acid.

Cleaner: This cleaner is acidic and its main function is to remove fingerprints, grease and other residues from the surface of the board to keep it clean. Therefore, the grease, fingerprints should be prevented as a priority: and must pay attention to the compatibility of the resist layer and the matching between other fluids in the same line, and reduce the surface tension, the ability to exclude air bubbles in the hole.

Micro-etching: As all kinds of dry film resist have additives to promote adhesion deep into the copper layer, 20~50u" of copper should be removed in this step to ensure a fresh copper layer to obtain good adhesion.

Washing: The main function is to wash the residual solution from the board surface and the holes.

Copper plating: The main components of the copper plating solution are copper sulphate, sulphuric acid, chloride ions, contaminants and other additives.
Their respective roles are as follows:
Copper sulphate: to provide the basic conductive copper ions required for plating to occur, the concentration is too high, although the operating current density can be slightly higher than the upper limit, but due to the concentration gradient difference is large, easy to cause Throwingpower**, and copper ions are too low, because the deposition rate is easily greater than the speed of diffusion movement, resulting in hydrogen ion reduction and the formation of scorching.

Sulphuric acid: To provide a conductive acid ion to the bath. The ratio of sulphuric acid to copper is usually considered as "18g/l of copper metal + 180g/l of sulphuric acid" to maintain the acid to copper ratio above 10/1, 12:1 is better, ** not less than 6:1, high acid and low copper amount is prone to scorching, while low acid and high copper is not conducive to ThrowingPower.

Chlorine ion: Its function is twofold, to help dissolve the anode properly and to help other additives to form a glossy effect, but too much chlorine ion will easily cause polarisation of the anode. Insufficient chloride ions can lead to abnormal consumption of other additives and imbalances in the bath (even fog deposition or step plating at very high levels; levelling** at too low levels).

Other additives: The combined function of all other organic additives can achieve a regular crystalline arrangement of the lustre effect and improve the physical strength of the plating, while a relative excess of additives can easily cause the decomposition and oxidation of organic matter, pollution of the bath, increase in the frequency of activated carbon treatment, or an increase in the co-precipitation ratio of organic matter, resulting in increased internal stress and reduced ductility of the plating.

Pollutants: Organic and inorganic pollutants can be distinguished, as the destruction of the equiaxial crystalline structure causes physical deterioration and co-precipitation causes deterioration in appearance. The sources of organic contamination are: oxidative decomposition of lustre agents, inks, dry films, baths, filters, anode bags, hanger cladding films and other filtered out substances and environmental pollutants. The sources of inorganic pollution are: environmental pollution, water pollution and basic material pollution.

  • Categories:Industry News
  • Author:Becky Su
  • Origin:
  • Time of issue:2023-05-27 11:04
  • Views:
Information

Electroplating process and role

Acid dip: the main role is to remove the oxide layer on the board surface, to avoid water brought into the copper cylinder and affect the content of sulphuric acid.

Cleaner: This cleaner is acidic and its main function is to remove fingerprints, grease and other residues from the surface of the board to keep it clean. Therefore, the grease, fingerprints should be prevented as a priority: and must pay attention to the compatibility of the resist layer and the matching between other fluids in the same line, and reduce the surface tension, the ability to exclude air bubbles in the hole.

Micro-etching: As all kinds of dry film resist have additives to promote adhesion deep into the copper layer, 20~50u" of copper should be removed in this step to ensure a fresh copper layer to obtain good adhesion.

Washing: The main function is to wash the residual solution from the board surface and the holes.

Copper plating: The main components of the copper plating solution are copper sulphate, sulphuric acid, chloride ions, contaminants and other additives.
Their respective roles are as follows:
Copper sulphate: to provide the basic conductive copper ions required for plating to occur, the concentration is too high, although the operating current density can be slightly higher than the upper limit, but due to the concentration gradient difference is large, easy to cause Throwingpower**, and copper ions are too low, because the deposition rate is easily greater than the speed of diffusion movement, resulting in hydrogen ion reduction and the formation of scorching.

Sulphuric acid: To provide a conductive acid ion to the bath. The ratio of sulphuric acid to copper is usually considered as "18g/l of copper metal + 180g/l of sulphuric acid" to maintain the acid to copper ratio above 10/1, 12:1 is better, ** not less than 6:1, high acid and low copper amount is prone to scorching, while low acid and high copper is not conducive to ThrowingPower.

Chlorine ion: Its function is twofold, to help dissolve the anode properly and to help other additives to form a glossy effect, but too much chlorine ion will easily cause polarisation of the anode. Insufficient chloride ions can lead to abnormal consumption of other additives and imbalances in the bath (even fog deposition or step plating at very high levels; levelling** at too low levels).

Other additives: The combined function of all other organic additives can achieve a regular crystalline arrangement of the lustre effect and improve the physical strength of the plating, while a relative excess of additives can easily cause the decomposition and oxidation of organic matter, pollution of the bath, increase in the frequency of activated carbon treatment, or an increase in the co-precipitation ratio of organic matter, resulting in increased internal stress and reduced ductility of the plating.

Pollutants: Organic and inorganic pollutants can be distinguished, as the destruction of the equiaxial crystalline structure causes physical deterioration and co-precipitation causes deterioration in appearance. The sources of organic contamination are: oxidative decomposition of lustre agents, inks, dry films, baths, filters, anode bags, hanger cladding films and other filtered out substances and environmental pollutants. The sources of inorganic pollution are: environmental pollution, water pollution and basic material pollution.

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