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SAMSUNG CP45FV NEO MACHINE SAMSUNG CP45FV NEO Mounter Core Characteristics Analysis I. Core Performance Indicators Mounter speed: Theoretical peak: 14,900 CPH (for 1608 package chips), high-speed mode can be increased to 20,224 CPH (specific configuration required); Full vision recognition: Fly Vision + Stage Vision dual system parallel processing, reduce component recognition time consuming, enhance the efficiency of continuous placement. Placement accuracy: Standard components: ±0.08mm (0402 chips), ±0.04mm (QFP type ICs); Fine pitch support: minimum support for 0.3mm pitch QFP and 0.5mm pitch CSP/BGA, to meet the needs of precision packaging.
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