SAMSUNG CP45FV NEO MACHINE

SAMSUNG CP45FV NEO MACHINE SAMSUNG CP45FV NEO Mounter Core Characteristics Analysis I. Core Performance Indicators Mounter speed: Theoretical peak: 14,900 CPH (for 1608 package chips), high-speed mode can be increased to 20,224 CPH (specific configuration required); Full vision recognition: Fly Vision + Stage Vision dual system parallel processing, reduce component recognition time consuming, enhance the efficiency of continuous placement. Placement accuracy: Standard components: ±0.08mm (0402 chips), ±0.04mm (QFP type ICs); Fine pitch support: minimum support for 0.3mm pitch QFP and 0.5mm pitch CSP/BGA, to meet the needs of precision packaging.

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- Brand: SAMSUNG
- Commodity name: SAMSUNG CP45FV NEO MACHINE
- Commodity ID: CP45FV NEO
SAMSUNG CP45FV NEO MACHINE SAMSUNG CP45FV NEO Mounter Core Characteristics Analysis I. Core Performance Indicators Mounter speed: Theoretical peak: 14,900 CPH (for 1608 package chips), high-speed mode can be increased to 20,224 CPH (specific configuration required); Full vision recognition: Fly Vision + Stage Vision dual system parallel processing, reduce component recognition time consuming, enhance the efficiency of continuous placement. Placement accuracy: Standard components: ±0.08mm (0402 chips), ±0.04mm (QFP type ICs); Fine pitch support: minimum support for 0.3mm pitch QFP and 0.5mm pitch CSP/BGA, to meet the needs of precision packaging.

SAMSUNG CP45FV NEO MACHINE

SAMSUNG CP45FV NEO Mounter Core Characteristics Analysis
I. Core Performance Indicators
Mounter speed:
Theoretical peak: 14,900 CPH (for 1608 package chips), high-speed mode can be increased to 20,224 CPH (specific configuration required);
Full vision recognition: Fly Vision + Stage Vision dual system parallel processing, reduce component recognition time consuming, enhance the efficiency of continuous placement.
Placement accuracy:
Standard components: ±0.08mm (0402 chips), ±0.04mm (QFP type ICs);
Fine pitch support: minimum support for 0.3mm pitch QFP and 0.5mm pitch CSP/BGA, to meet the needs of precision packaging.
II. Component and substrate compatibility
Component range:
Minimum size: 0402 (metric 1005) chips;
Maximum size: Supports □42mm IC (in fixed camera mode);
Coverage type: CHIP, QFP, SOP, PLCC, BGA and other mainstream packages.
Substrate processing capability:
Standard size: L460×W400mm;
Expansion option: 1.2 meters long LED light board can be supported by modification (CP-03 expansion system is required);
Thickness range: 0.38-4.2mm (for rigid and flexible boards).
III. Vision and Feeding System
Vision module:
Fly Vision: Fast identification of small size components (1005 to □22mm IC);
Stage Vision: Highly accurate processing of □32mm IC and 0.4mm fine pitch components (FOV35 mode).
Feeder Configuration:
Feeder capacity: Supports up to 120 8mm tape feeders, compatible with 8-56mm wide feeders and trays;
Pneumatic optimization: air consumption 160NL/min, reduce energy consumption.
IV. Expandability and Application Scenarios
Retrofitting capability:
Support ultra-long board mounting (e.g. LED strip) through hardware expansion to meet the special needs of the lighting industry;
Compatible with the black box upgrade module, to achieve rapid switching between long and short board production mode.
Applicable fields:
Consumer electronics, LED lighting modules, small and medium batches of multi-species PCB board placement.
V, hardware and maintenance characteristics
Drive system: servo motor control X/Y/Z axis, stable operation and fast response speed;
Maintenance convenience:
Modular structure simplifies the process of component replacement;
Supports online diagnostic tools to shorten faulty downtime.
CP45FV NEO with high speed and high precision, wide component compatibility and flexible expansion capability as the core advantages, especially suitable for LED lighting and small and medium batch electronic The CP45FV NEO is particularly suitable for LED lighting and small- to medium-volume electronics manufacturing scenarios, combining productivity and cost control. Its modification potential further broadens the application scope to meet diversified industrial needs.

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