Hanwha bonder (Samsung bonder) SM471/SM481 bonder/SM482 bonder program management and optimization method This issue to explain the Hanwha bonder (Samsung bonder) program management and optimization, for the model Hanwha bonder SM471plus / Hanwha bonder SM481plus, Hanwha bonder SM482plus, etc. (Note: professional agent Hanwha new bonder). Need to explain to the directory as follows: 1、Component library update 2、Merge component library 3, the management of the program file 4, component type and the proportion of the chip point allocation 5、The allocation of material station 6、Component library parameter setting 7、Nozzle configuration and binding optimization 8、Program check 9、Program modification specification I,Hanwha SM471/SM481/SM482 - Component Library Update Return the production program of the shift Use the SMART software to open the returned program to update the SMD material number of the library (10 minutes a day is enough) II,Hanwha SM471/SM481/SM482-Merge Component Library Merge SM471 with 481 and 482 PARTDB (as below) III,Hanwha SM471/SM481/SM482 - Management of program files The program files were originally placed in one folder, but now there is one folder for each model for easy access to the programs. The programs of cross mode and independent mode are put in two folders respectively. Fourth, Hanwha SM471/SM481/SM482 - component type and the proportion of SMD points allocation 1, less than or equal to 0402 resistive material priority placement SM471 optimization. 2, greater than or equal to 0603 / crystal class materials such as priority placement SM481 optimization. 3, BGA, QFN, interface class materials such as priority placement SM482 optimization. 4, according to the general ratio of SMD points 6:3:1. V,Material station allocation-Hanhua SM471/SM481/SM482 1、According to the amount of material and the number of nozzles used to do the corresponding number of feeders set to achieve the * best cycle. 2、The arrangement of the station is centered on the docked PCB and spreads to both sides in turn. 3、If the material station allows, SM471 can place the empty TRAY tray at stations 1-13 during program optimization to prevent the benchmark camera from taking the material position. Six,Hanwha SM471/SM481/SM482-component library parameter setting 1、The light brightness of general resistive parts is set to 3 7 respectively, and the mounting speed is full speed. 2、The light and mounting speed of the shaped parts can be adjusted accordingly according to the actual situation. 2、The resistive capacitive parts below 1206 need to open vacuum detection, which can prevent the suction nozzle from dirty mismeasurement leading to leakage detection, and the resistor needs to open anti-backlash function. Seven,Hanwha SM471/SM481/SM482-nozzle configuration and binding optimization 1、According to the amount of material to configure the total class and number of nozzles, to meet the program optimization needs 2, according to the number of nozzles demanded to fix the HEAD and nozzles after optimization, the production process will not need to replace the nozzles. Eight, Hanwha SM471/SM481/SM482-program check 1. According to the order number given by the plan and then find the BOM in the mail, create a folder in the computer checklist (folder naming rule is model number + order number), copy the BOM into the folder for splitting. 2. use SMART software to open each one of the program, do not extend, only copy the patch point number, paste it into the split table, if it is BOT surface ** table on the back plus B1, and so on. Use EXCEL for comparison, comparison is completed with automatic screening to view the results of the comparison, check the 3 machines patch points 3. Fill in the verification records on the program verification record sheet. Nine, Hanwha SM471/SM481/SM482-program modification specification 1、If any abnormality is found after the program check, the program on 3 machines must be modified, and it is strictly forbidden to modify only one program that needs patching. 2、Modify the check again after the completion of the check, the check is correct after printing the station table 3, fill out the program modification checklist, including the modified points and modified before and after the material number. 4、If the program needs to delete the material, it must re-optimize the balance CT, and the quantity difference must be re-imported into CAD for optimization. Prevent coordinate offset and modification error. Ten, year-round agent sales Hanwha Samsung new mounter, agent of the hot models include: 1, Hanwha Samsung brand new SMD machine SM471plus (high-speed CHIP mounter). 2,Hanwha Samsung brand new bonder SM481plus(high speed and high precision bonder); 3,Hanwha Samsung brand new bonder SM482plus(multi-functional bonder)

Hanwha Samsung mounter error message: When the power is turned on, No Signal on the monitor (Monitor) Code:E0500 No Signal on Monitor when power is turned on. [Cause]: 1. PC power supply input (220V), output (5V, 12V) voltage problem 2. SBC board electrolytic capacitor alarm (beeping sound) 3. CPU and Memory of SBC board are not properly inserted 4. Frequent boot errors and boot failures causing HDD damage   Only applicable to SM-Series devices 5. SBC board and CPU** (beeping sound) 6. PC Rack internal temperature rises causing the board to act improperly 7. SBC board problem (beeping) and Back Plane problem (no beeping) 8. Front USB Extend cable problem 9. CMOS information of SBC board is wrong 10. Com 1,2 Port problem of SBC board 11. 24V Magnetic switch 12. SBC board and CAN Master board 13. Composite problem   SBC board and Back Plane board damage, CPU damage, virus infection, CPU temperature rise, etc. 14. Main power supply is unstable 15. CPU cooling fan damaged causing CPU overheating 16. Display is damaged or not connected to the signal cable [Check method]  1. When the power is on, check if the cooling fan on the VME Rack is operating normally. If the fan is not operating, check if the input (220V) and output (5V, 12V) voltages of the PC power supply are normal. 2. If the cooling fan operates, check if the electrolytic capacitor body of the SBC board is protruding. 3. Check if the CPU cooling fan is operating normally, and make sure the CPU or Memory is properly inserted into the socket. 4. Check whether the HDD can be recognized normally on CMOS SETUP 5. Replace the SBC board and CPU to make sure they start up properly. 6. Check if the shop temperature is above 24º. 7. Replace the SBC board and Back Plane board and verify that they start up properly. 8. Check if the connection of Front USB extension cable is normal 9. Test the SBC CMOS Reset and make sure the message "CMOS is set to default" is displayed on the screen. 10. Confirm that the Com 1,2 Port of the SBC board is normal. 11. Confirm that the Safety & Control board Relay (CP1) is operating normally. 12. After replacing the SBC board and CAN Master board, make sure that they start normally. 13. Check if the SBC board, Back Plane board, CPU, HDD and cooling fan are operating normally. 14. Check if the main voltage is supplied normally. 15. Check if the CPU cooling fan is operating normally 16. check whether the connection of monitor power and signal line is normal, if there is no abnormality, then switch to another monitor and confirm whether the normal screen is displayed. [Measures]  1. If the input and output of the PC power supply are not normal, replace the PC power supply. 2. If the electrolytic capacitor of SBC board**, replace the SBC board. 3. Assemble the CPU, Memory and board support frame of SBC board correctly. 4. Replace the HDD and implement Recovery, reinstall the MMI. 5. Replace the SBC board and CPU. 6. Take off the Dummy Slot Cover to release the heat inside the PC Rack and reboot. 7. Replace the SBC board and Back Plane board. 8. Replace the Front USB Extend cable. 9. Set the jumper of SBC board and implement CMOS Reset of SBC board. 10. Replace the SBC board. 11. Replace the 24V Magnetic switch (Relay) on the Safety & Control board. 12. Replace the SBC board and Can Master board. 13. 13. For the abnormal part, apply heat-resistant grease between CPU and CPU cooling fan (CPU temperature will drop about 20 degrees) after referring to the measures proposed earlier. 14. If the input power is unstable, it is recommended to install AVR. 15. Replace the CPU cooling fan. 16. Replace the monitor or reconnect the power cable and signal cable connected to the monitor. We are a permanent agent of Hanwha bonder, and our hot models include: 1, Hanwha Samsung brand new bonder SM471plus (high-speed CHIP bonder). 2,Hanwha Samsung brand new bonder SM481plus(high speed and high precision bonder); 3,Hanwha Samsung brand new bonder SM482plus(multi-functional bonder)

Hanwha SM471plus compared to Panasonic CM602, SM471 and CM602 which is better? We often encounter customers in Hanwha bonder SM471plus and Panasonic bonder CM602 to do a comparison, torn between which machine to buy, in the end which machine is better? Let's take a look at the model parameters: 一, Hanwha high-speed mounter SM471plus model parameters. 1, placement speed. 78,000 CPH (Optimum) 2, the number of axial rod: 10 axial rod x 2 cantilever 3,Corresponding components. 01005~ □14mm(H 12mm) 4,Placement accuracy  50Л@レ+3ヲ/Chip  5,Substrate size(mm). Single track Max. 510(L) x 460(W)  Max. 610(L) x 460(W)(Option) Double rail Max. 460(L) x 250(W)  Max. 610(L) x 250(W)(Option)  6,PCB thickness: 0.38-4.2mm 7,Number of feeders(8mm reference):120ea/112ea 8,Energy consumption. Power supply AC200/208/220/240/380/415V(50/60HZ,3Phase) Max.5.0kva Air consumption 0.5-0.7MPa(5-7kgf/cm2) 350N/min 9,Dimension: 1,650(L) x 1,690(D) x 1,485(H) 10,Weight: about 1820kg Note: New in production machine Warranty 24 months. Two, Panasonic high-speed mounter cm602 parameters. 1,Substrate size L 50 mm × W 50 mm ～ L 510 mm × W 460 mm 2,High-speed mount head 12 nozzles Mounting speed 100 000 cph (0.036 s/chip) Mounting accuracy ±40 μm/chip (Cpk ≧1)  Component size 0402 chip *5 ～ L 12 mm × W 12 mm × T 6.5 mm 3,Substrate replacement time m0.9 s (substrate length of 240 mm or less * when the best conditions) 4,Power supply Three-phase AC 200, 220, 380, 400, 420, 480 V, 4.0 kVA 5,Air pressure source*1m0.49 MPa, 170 L/min(A.N.R.) 6,Equipment size mW 2 350 mm × D 2 290 mm *2 × H 1 430 mm *3 7,Weight*4m3 400 kg Three, comparison results (Hanwha bonder SM471plus and Panasonic bonder CM602) 1, the year Hanwha SM471plus win (SM471 new: CM602 for about 2010). 2, speed Panasonic CM602 small victory (CM602 speed 100,000: SM471 speed 78,000). 3, price/price ratio Hanwha SM471plus win (SM471 price is nearly 30% cheaper). 4,After-sales service SM471plus wins (SM471 is 24 months: CM602 is generally 3 months). 5, applicability CM602 win (CM602 optional high-speed head + multifunctional head). Summary: If you pay attention to the cost and product stability, you can choose Hanwha SM471plus, SM471plus for the new machine CM602 has long been discontinued for the second hand.           If you are used to using Panasonic, the factory is all Panasonic machine, choose Panasonic CM602 better.

How to buy a bonder? What is a medium speed bonder,what is a high speed bonder? Many people who are new to SMT production lines are hesitant about what kind of bonder to buy, whether to purchase a medium speed bonder? Or high speed bonder? First, the following talk about the difference between medium speed bonder and high speed bonder, for buying machine friends reference. 1, according to the mounter placement speed distinction (1)Theoretical placement speed of medium speed bonder is generally 20000< piece/h (piece component) or so; (2)High speed mounter's theoretical mount speed is generally 30,000～80,000 pieces/h per hour (this mainly refers to mount 0201 01005 following piece type component as standard). 2,SMT mounter model structure: (1)Medium speed mounter mostly uses arch frame type structure, relatively speaking the structure is simple, covers an area smaller, the requirement for environment is lower (2) high speed mounter more modular design (10 more than 20 years ago the turret structure has been discontinued, by the times out). 3, from the mounter mount products on the distinction. Medium speed mounter mainly can be used as mount large components, high precision components and shaped components, can also mount small chip components; high speed mounter mainly available to mount small chip components and small integrated components. 4,From SMT mounter applicable range distinction. (1)Medium speed bonder is mainly used in some small and medium-sized electronic production and processing enterprises, research and development design centre and product characteristics for many varieties of small batch production enterprises widely used; (2) High-speed bonder is mainly used in large electronic manufacturing enterprises and some professional original equipment manufacturing enterprises (OEM) in a large number of. 5, from the price aspect to distinguish: Medium-speed bonder price is relatively cheap, high-speed bonder is generally medium-speed bonder price expensive 60% or so. After understanding the difference between medium speed and high speed bonder, you can combine your budget to buy the machine you like. Two, examples of medium speed bonder, high speed bonder brand models: 1, medium speed bonder (biased towards high speed bonder) Hanwha bonder SM481plus model parameters:  Positioning: flying camera + fixed camera (optional)  The number of mounting axis pole: 10 axis pole x 1 cantilever  Mounting speed: 40,000 CPH (*optimal condition)  Corresponding components:    01005 ~ □42mm (H 15mm)  PCB size (mm):    460(L) x 400(W) 510(L) x 460(W) (option)   610(L) x 510(W) (option) 740(L) x 460(W) (option)  PCB thickness: 0.38 - 4.2mm  Number of feeders (8mm base): 120ea/112ea  Energy consumption.   Power supply AC200/208/220/240/380/415V(50/60HZ,3Phase)         Max.4.7kva   Air consumption 0.5-0.7MPa(5-7kgf/cm2) 160N/min  Dimensions: 1,650(L) x 1,680(D) x 1,530(H)  Weight: approx. 1655kg 2,High speed bonder Hanwha mounter SM471plus model parameters.  Mounting speed.   78,000 CPH(Optimum)  Number of axial rods: 10 axial rods x 2 cantilever  Corresponding components.   01005~ □14mm(H 12mm)  Mounting accuracy    50Л@レ+3ヲ/Chip   Substrate size (mm).   Single track Max. 510(L) x 460(W)        Max. 610(L) x 460(W)(Option)   Double rail Max. 460(L) x 250(W)        Max. 610(L) x 250(W)(Option)   PCB thickness: 0.38-4.2mm  Number of feeders (8mm base): 120ea/112ea  Energy consumption.   Power supply AC200/208/220/240/380/415V(50/60HZ,3Phase)         Max.5.0kva   Air consumption 0.5-0.7MPa(5-7kgf/cm2) 350N/min  Dimensions: 1,650(L) x 1,690(D) x 1,485(H)  Weight: approx. 1820kg

Hanwha mounter DECAN S2,Hanwha high speed mounter magnetic levitation mounter introduction Better area capacity than competitor's class equipment, * Optimized high-speed placement of small components One, Hanwha mounter DECAN S2 advantage:  High Performance - 2 Gantry, Flying Vision Head - 92,000 CPH(Optimum, HS10 Head) High Reliability - Applicable Linear Motor, high precision, low noise - Accuracy ±28um@ Cpk≥1.0(03015) Flexible Production - Modular Conveyor System  - PCB mountable 740mmx460mm Easy Operation - Can be mixed with pneumatic/electric feeders - Support smart Feeder Two, Hanwha mounter DECAN S2 features. Improve the actual production capacity 1 Improve Flying Vision  Enhance LED quality at each Head position to reduce lighting deviation     - Improve the visual recognition difference between Heads  Improve coaxial lighting Contrast    - **Ghost caused by coaxial lighting, improve component recognition rate 2 Improve S/W : Increase placement speed (80,000 CPH->92,000 CPH)  Reduce Cycle time   - Local reference points are assigned according to the number of placements in the relevant Cycle (5ms↓)  Change of Z-Axis Inposition Count (51um->66um)   - Minimize the deviation* of placement height when placing High precision placement Achieves Placement Accuracy ±28? (03015)   Improved visual recognition and placement accuracy of 03015 components    - By reducing FOV (24->20.5mm)      Increase the number of Pixel per unit (6.5 -> 7.6)  Improve X-axis position precision (resolution: 3um->2um)     - Change X-Ball screw configuration (Pitch: 30mm -> 20mm)     - Ease load rate Change motor configuration  Improvement of Y-axis position precision(Resolution: 3um ->2um)     - Change of linear motor parameters (3um ->2um) Provide a wide variety of PCB Flow Supports Modular Conveyor System that can be changed in the field to produce a wide variety of species  IN/ OUT Conveyor Module can be changed quickly in the field (Shuttle method? Dual method)  Work time required to change modules (mechanical and H/W for example): ~2 hours or less  Range of attachable components (as shown) Hanwha mounter DECAN S2 1 Enhanced ease of equipment software management 2 Optimized software installed in the machine enables simple program creation/editing 3 Large LCD screen provides a variety of work information 4 Highly convenient, high-precision electric feeder 5 Calibration Free & Maintenance Free Electric Feeder 6 Single feeder with Reel Bank structure improves work convenience 7 Automatic alignment of component pick-up positions between feeders increases actual productivity 8 Automated feeder to reduce workload by half (SMART FEEDER) 9 The industry's first automatic feeding and receiving function  The manual feeder preparation and splicing operation has been changed to an automatic method, which significantly reduces the operating time and achieves zero consumption of splicing consumables. Three, Hanwha mounter DECAN S2 model information: 1 Speed: 92000CPH 2 Accuracy: CHIP 28um(03015),IC 25um 3 Attachable components (mm): Chip 03015 ~5 axes: 12-h10 10 axes: 6-h10 4 Number of axes: 10 x 2 Head 5 Fly Camera FOV:20.5mm 6 PCB size:50 x 40 ~ 510 x 460mm       Max. 740 x 460 mm (1,200 x 460 mm) 7 Feeding station:120ea 8 Machine weight:1,800kg 9 Machine size(mm):1,430(L) x 1,740(D) x 1,485(H) 10 Power supply: 3 phase AC 200/208/220/240/380/415V ±10%.         50/60Hz;Max. 5.0 Kva DECAN S2 Advanced Chip shooter 1 Speed : 92,000 CPH (Optimum) 2 Structure : 2 Gantry x 10 Spindles/Head 3 Accuracy : ±28μm Cpk≥1.0 (03015 Chip)                     ±25μm Cpk≥1.0 (IC) 4 Parts Size : 03015~□55mm (H15mm) 5 PCB Size : L510xW460mm (Standard)                     L1,200xW460mm (Option) 6 Wide Part Handling Capability 7 Various PCB Transfer Systems 8 Verified Production History Management Solution 9 High Speed Placement