SMT workshop preparation planning instructions SMT workshop planning manual, the following is a DEK + KE2050*2 + KE2060 + HELLER as an example. I. Preparation of power ; 1. DEK is a single-phase power supply, with ordinary plugboard. 2. as the power of JUKI KE2000 series is 3KW, the power of HELLER is 33KW, so it needs a 10KVA and a voltage regulator of more than 40KVA. 3. HELLER's power supply is 3-phase fire wire + 1 ground wire with a wire diameter of 25mm2. 4. JUKI's power supply for the 3-phase fire + 1 ground wire, the wire diameter of 6mm2. Second, the workshop preparation. 1. add a layer of transparent diaphragm adhesive before entering the SMT workshop, or make a locker room. 2. treat the ceiling accordingly to reduce the consumption of cold air. 3. According to the size of the equipment and the planning of the production line, calculate the area required for the workshop. Third, the preparation of air pressure 1. The outer diameter of the air trunk shall be 38mm, and the inner diameter of the flexible air pipe connected to the equipment shall be 12mm, and can withstand the pressure of 8Kg/mm2. 2. The working air pressure of the placement machine is 0.5Kg/mm2, so the * high air pressure of the compressor should reach 8Kg/mm2, gas flow 1.5mm3/min, power 15 horsepower, storage tank capacity of 2mm3, and equipped with a 2.5m3 dryer and two U-shaped filter. Fourth, the installation of air conditioning, and the installation of hygrometer and centigrade meter in the appropriate location, the workshop humidity in the middle of 50-70%, centigrade control in the middle of 18-25oC.

Problems that should be noted when dispensing glue Products are prone to many defects in dispensing: substandard glue dot specifications, glue dipping, pulling, bad curing strength easy to fall off and other problems. To solve these problems, the overall study of its technical parameters should be.  1、Needle specifications 　　In the actual operation, the inner diameter of the needle specification should be about 1/2 of the diameter of the dispensing glue point, dispensing process, according to the industry specifications to select the dispensing needle. In the process of dispensing, the dispensing needle should be selected according to the industry specifications. Different needles should be selected for industries with different specifications, so as to ensure the quality of the glue dot and improve the production efficiency.  2、Dispensing pressure 　　The dispensing equipment provides a certain pressure to the syringe (glue gun) to ensure the glue supply, and the pressure specification determines the glue supply volume and glue flow rate. Too much pressure may cause glue overflow and too much glue; too little pressure may lead to intermittent glue dispensing and leakage, thus causing industrial defects. The pressure should be selected according to the nature of the glue and the operating temperature. High peripheral degree Celsius will make the glue viscosity smaller and fluidity better, then the pressure value should be adjusted down, and vice versa.  3、Specification of dispensing volume 　　According to the operation experience, the specification of glue dot diameter should be half of the industrial spacing. This will ensure that there is sufficient glue to bond the components and avoid too much glue. The amount of glue dispensed is determined by the length of time, and in practice, the dispensing time should be selected according to the production situation (room temperature, viscosity of the glue, etc.).  4、Viscosity of glue 　　The viscosity of glue directly affects the quality of dispensing. If the viscosity is large, the glue point will become smaller, even pulling; if the viscosity is small, the glue point will become larger, and then it may bleed into the industry. In the process of dispensing, the glue with different viscosity should be selected with reasonable pressure and dispensing speed.  5、The distance between the needle and the operating surface 　　Different dispensing machines use different needles, and some needles have a certain stopping degree. The calibration of the distance between the needle and the operating surface should be done before each operation starts, i.e. Z-axis height calibration.  6、Curing degree Celsius curve 　　For the curing of the glue, the manufacturer has generally given the Celsius curve. In practice, a higher degree Celsius should be used as far as possible to cure, so that the glue cured with sufficient strength.  7、Bubbles     The glue must not have bubbles. A small bubble will cause many industries without glue; every time when replacing the hose midway should empty the air at the connection to prevent the phenomenon of empty play.  8、Glue Celsius degree 　　The general epoxy resin glue should be kept in the refrigerator at 0~5℃, and taken out half an hour in advance when applying, so that the glue Celsius degree is consistent with the operation surrounding. The application degree of glue should be 23℃～25℃; the peripheral degree of Celsius has great influence on the viscosity of glue, the degree of Celsius decreases and the viscosity increases, the flow of glue becomes smaller accordingly, and the phenomenon of drawing is more likely to appear. The difference of 5℃ in the peripheral degree Celsius under the same condition will cause a 50% change of the glue output specification, so the peripheral degree Celsius should be controlled. At the same time, the surrounding temperature should also be given to ensure that the temperature is too high glue point easy to dry, affecting the bonding force.  9、The fluid instant glue which needs special setting: for water-based instant glue, apply **type piston and Teflon lined metal needle, for thick instant glue, apply conical slanting needle, if need flexible, apply PP needle.    Anaerobic glue: apply 10CC syringe and white PE general purpose piston.    UV glue: apply amber syringe, white piston and oblique needle (can cover UV) If you apply other kinds of needles, please order the needle that can cover UV.    Light-curing glue: Apply black opaque syringe to avoid light sensitivity.    Sealant and paste fluid: if the application of white piston rebound serious, please change to ** type live type, the application of oblique needle.  10、 Needle selection concise comparison table   　In production should be adjusted in accordance with the actual situation of each parameter, both to ensure the quality of production, but also to improve production efficiency. For the adjustment of each parameter, should be adjusted by point and

AOI automatic optical inspection instrument Automated Optical Inspection (AOI, Automated Optical Inspection) 　　I. Definition 　　Using high speed and high precision vision processing technology to automatically detect different kinds of mounting errors and soldering defects on PCB boards. 　　PCB boards can range from fine pitch high density boards to low density large size boards, and can provide in-line inspection solutions to improve production efficiency and solder quality. 　　By using AOI as a defect reduction tool, errors can be found and eliminated early in the assembly process to achieve good process control. Early detection of defects will prevent bad boards from being sent to subsequent assembly stages, and AOI will reduce repair costs by avoiding scrapping unrepairable boards. 　　Second, the main features 　　1) High-speed inspection system 　　Independent of PCB mounting density 　　(2) Fast and convenient programming system 　　- Graphical interface for 　　-Automatic data inspection with mounting data 　　-Fast editing of inspection data using component database 　　3）Use of a wealth of special multifunctional inspection algorithms and binary or grayscale 　　(3) Inspection using a wide range of dedicated multifunctional inspection algorithms and binary or grayscale optical imaging processing technology 　　4) Automatic correction of the detection window according to the instantaneous change of the position of the inspected component 　　Automatic correction to achieve high accuracy detection 　　(5) Detection by marking directly on the PCB with ink or by graphical error representation on the operation display 　　on the operating display with graphic errors to check the detection of electricity

Modular mounter cm402 PanasonicCM402 Single Platform Solution: One Platform Industry* high productivity, 0.06S/CHIP (60,000cph) Flexible variety switching capability and wide range of component matching capability High production capacity. - Achieves high speed with a capacity of 60,000 CPH (system upgrade capable of reaching 66,000 CPH) - Substrate delivery time* as fast as 0.9 seconds. Flexible substrate transport, reducing lost transport time High efficiency. - CP/CPK self-check function, customers can check the accuracy of the equipment themselves during the use of the equipment - 0603 narrow pitch placement component absorption rate and product once pass through rate is the highest in the business world*, such as the current mass production of Ipod MP3 - To realize 100% automatic insertion of hand inserted components by program-controlled precision pressure insertion. For example: I/O port, shaped connector, copper column, etc. Flexible wiring options. Based on a single platform design, the CM402A/B/C models can be changed to high-speed machines/universal machines/combined machines by simply changing the head and adding a tray feeder (TRAY) - Highly efficient production with a large number of proven reliable designs that significantly reduce downtime - Fewer types of production line carriers in the world*. A total of 5 types of racks can be used for all types of tape elements. - Intelligent tape racking, automatic selection of transfer method according to components, and various other intelligent functions - Single machine* can mount up to 216 types of components - A bracket type trolley exchange connection / braiding / shelf and other filling peripheral devices to achieve non-stop material change, the actual production cranking rate of 85%-90% High placement accuracy. - High-precision placement 50μm (Cpk≧1.0) high-precision base-machine, and with high-precision calibration function and - A variety of flexible combination of ways to meet the different needs of production Perfect software system. - Simple process software, a one-time completion of the single machine optimization and production line balance optimization - LINE COMPUTER management system to monitor production management information and material usage at all times - IPC intelligent component tracking system, not only to track PCB ID and prevent material change errors, but also to monitor and provide feedback to the entire production line (including monitoring of printing presses and reflow ovens) at all times. Equipment name ：CM402 Type of mounting head: High-speed general purpose No. of nozzles: 8 nozzles / head × 4 3 nozzles / head × 4 Mounting speed: 0.06 sec / Chip 0.21sec/Chip Mounting accuracy: ±0.05mm ±0.035mm Number of shelves: *Up to 216 stations (8mm double) shelves Corresponding component size.     0603C/R--L24mm×W24mm     0603C/R--L100mm×W90mm Substrate size: L50mm×W50mm~L510mm×W360mm Features. - Supports a wide range of chip component placement, from 0201 chip to 24mm X 24mm in high-speed machine mode, and from 0201 chip to 90mm X 100mm in multi-function machine mode. - High throughput of 60,000 CPH, the highest in the industry*. - Holds up to 216 types of materials (with 8mm dual shelves) - Standard trolley type one-touch changeover, belt splicing, and continuous replenishment - Board transfer time of 0.9 seconds Flexible board transfer reduces transfer time loss. - User can freely switch between A, B and C production modes on site depending on the production target. Type A High Speed Head + High Speed Head Type B Multifunctional Head + Multifunctional Head (can be equipped with pallet feeder) Type C High-speed Head + Multi-functional Head (can be equipped with pallet feeder) If you want to switch freely between high-speed and multifunctional machines on one bonder, the CM402 with its fast switching platform is the right choice for you. Its high speed mode has a capacity of 60,000 CPH and ±50μm accuracy for substrates up to 18 "x 20". Its multi-function mode also has a capacity of 17,140 CPH and ±35μm accuracy. In addition to high speed and switchability, the CM402 has several other advantages. Its user-friendly interface makes operation and programming easy and simple. It allows for fast substrate transfer and easy product changeover, minimizing production crop losses.

Hanwha SM471 mounter (Samsung SM471) component supply error analysis and solution Chapter 1. MMI Error Code and Problem Solving 1.1. Trouble Shooting Guide General principles If any of the following errors occur during the operation of the equipment, first take the measures described in [Countermeasures] in this manual. If an error still occurs after taking measures or if an error not covered by this manual occurs, please contact us after taking the following measures. First, save the record file necessary for taking measures to disk. If the error is related to the device driver, make all axes of the device return to the original point function, and then remove the error again. If the problem continues to occur, turn off the power to the device and restart it after about 10 seconds and remove the error once again. If the problem is still not solved after taking many of the above measures or retrying, please send the contents of the saved record file to our company for consultation on the contents of additional measures according to ** one of the measures. Generally speaking, when there is an abnormal software error or obstacle, it is possible to solve the problem as soon as possible by saving the following files and contacting our company. Job PCB file (a file with .pcb or .opt extension) Error log files (all files on the C:\SmartSM\Log folder) Device system files (all files on the C:\SmartSM\System folder) Warnings Please refer to the device status display field of the MMI to confirm the error level according to the error code. If the error level is Emergency (EMER) or Freeze (FREEZE), click the "STOP" button to turn off the buzzer and then click the "RESET" button to convert the device to "IDLE" status and take the appropriate action. The corresponding measures are taken. If it is MPU_STOP, turn off the device normally and restart it. If you adjust the sensor or perform debugging while the device is in the Ready state, you may be injured. Be sure to perform sensor adjustment and error removal in the Stop state after releasing Ready. 1.2.1. Absorption error (increase in waste rate) Component supply error Cause Major category:Incorrect belt installation Cause Medium category:Incorrect belt reel installation on belt feeder Remarks:E0000 Cause:Overturning/tilt phenomenon occurring Cause:Reel** Remark:E0110       Cause Medium category:Tape guide magnetized Remark:E0011       Cause:Tape guide/shutter deformation Remark:E0012       Cause:Shutter movement** Remark:E0013       Cause classification:Component supply speed**(shaped feeder) Remark:E0014 Reason large classification:Feeding** Reason medium classification:Feeder maintenance** Remark:E0020       Reason in classification:Motor action of belt feeder** Remark:E0021       Cause:Cylinder action of belt feeder** Remark:E0022       Cause:Insufficient feeding force of belt feeder Remark:E0023       Cause:Breakage and detachment of feeding spring Remark:E0024       Cause:Pitch error Remark:E0025       Cause:Indexing sensor** Remark:E0026       Medium classification of cause:Vibration of vibration feeder is too weak to move the component Remark:E0027 Cause Large category:Vinyl film discharge** Cause Medium category:Tape plastic is caught inside the tape guide Remark:E0030         Abnormal discharge of vinyl film Remark:E0031 Cause Large category:occurrence of strip JAM Cause Medium category:entrapment of component in strip discharge path Remark:E0040 Cause Large category:Component bouncing next to pickup Cause Medium category:Pickup Z setting error Remark:E0050                              Cause Medium Category:Pickup dropping fast Remark:E0051 2. Year-round agent sales of Hanwha Samsung brand new bonder, agent of the hot models include: 1,Hanwha Samsung brand new bonder SM471plus(high speed CHIP bonder). 2,Hanwha Samsung brand new bonder SM481plus(high speed and high precision bonder); 3,Hanwha Samsung brand new bonder SM482plus(multi-functional bonder). Advantages of Hanwha Samsung mounter: 1,Hanwha Samsung Chip Mounter SM471plus:   SM471puls high speed Chip mounter SM471 is equipped with 10 axial bars per placement head and apply double cantilever, the new flying camera high performance mounter, can achieve the world's class products * high speed of 78,000CPH.   In addition, 01005-14mm (H12mm) can be basically corresponded to, and by applying high-speed. The high precision electric feeder improves productivity and placement quality. In addition, it can share with SM pneumatic feeder* original SM3/SM4 series feeder, so it will be more convenient for old customers to use, and save the configuration of feeder (*New electric feeder can get *high precision and fast response speed, improve quality and productivity) 2,Hanwha Samsung mounter SM481plus:   SM481plus is the fastest machine in its class based on the platform of high-speed bonder SM471plus and enhanced for the VISION system. It is equipped with one cantilever, 10 axes, a new flying camera and th