SMT mounter placement rate Often listen to engage in smt people talk about the placement rate, SMT placement machine in the purchase when the main consideration of its paste fitting accuracy and placement speed, in the actual use process, in order to effectively improve product quality, improve production efficiency, improve the SMT placement machine paste fitting rate is particularly important.  smt placement machine placement rate is refers to in a certain time device actual placement number and suction number of ratio, which total abandoned pieces number is refers to suction with error number, recognition error number, standing piece number, lost number, etc., and recognition error and divided device specification size error and device optical recognition error two kinds. smt placement machine whether small machine, medium machine, large machine, also whether medium speed machine, high speed machine, they are mainly by device storage and transportation Device, XY table, mount head and control system composition. The mount head is the core and the key component of the mount machine, the mount head generally has the fixed head and the rotating head, the fixed general multi-head arrangement, less than 2, more than 8, can take the pieces at the same time or alone, the rotating head and divided in the horizontal plane rotation and in the vertical plane rotation.   smt placement machine placement process: 1, device suction up suction nozzle suction up height switch 2, θI rotation (±90') 3, device optical identification 4, device posture detection θ2 rotation (±90') 5, placement device/suction nozzle height switch 6, θ3 rotation (±180'-θ) suction nozzle Origin detection ** product exclusion 7、Nozzle conversion 8、Nozzle number detection according to the mounter from pick-up The whole process of mounting, simply from the mounter side, in the correct setting nozzle pickup height, pickup bit nozzle centre and the relative position of the feeder case, the main factors affecting his [see the rate of mounting is in the pickup position, according to the mounter statistics production information intelligence, its impact accounts for more than 80% of the entire impact factors. And the cause has: on the one hand is the device storage device on the feeder, on the other hand is the suction nozzle, both of which the influence of the feeder accounted for about 60%, about 40% is due to the suction nozzle pollution caused by.

SMT mounter common fault analysis and treatment Preface: when smt mounter malfunction, it is recommended to solve the problem along the following lines: A, detailed analysis of the smt mounter working order and the logical relationship between them. B, to understand the fault occurred in the part, link and its degree, as well as the presence of abnormal sound. C, to understand the operation process before the fault occurred. D. Whether it occurs on a specific placement head or nozzle. E. Whether it occurs on a specific device. F. Whether it occurs on a specific batch. G. Whether it occurred at a specific moment. Common fault for: A, smt placement machine components mount offset mainly refers to the components mount on the PCB after, in X-Y appear position offset, the reasons for its generation are as follows: (1) the reason of PCB board a: PCB board curvature warp degree exceeds equipment allows range. The upper warp* is big 1.2MM, the lower curve* is big 0.5MM. b: support pin height is inconsistent, resulting in the printed board support is not flat. c: table support platform flatness is bad; d: circuit board technology'> circuit board wiring precision is low, consistency is poor, especially the difference between batch and batch is big. (2) The blowing air pressure is abnormal when mounting. (3) mount suction nozzle suction with air pressure is too low, in taking the piece and posting should be in 400mmHG above. (4) Adhesive, solder technology'>Solder paste coating amount abnormal or deviation. Cause the component to mount when or weld the position to drift, too little cause the component to mount after the table high speed movement to appear to deviate from the original position, the coating position is not accurate, because its tension action and appear to deviate accordingly. (5) Program data equipment is incorrect. (6) The substrate positioning is bad. (7) X-Y working table power member and transmission member between the shaft linker loose. (8) The movement is not smooth when the mount suction nozzle rises, is more sluggish. (9) The mount head suction nozzle installation is not good. (10) Blowing time sequence and mounting head descending time sequence do not match. (11) Suction nozzle centre data, optical recognition system's camera's initial data set value is bad. B, smt mount machine device mount angle offset mainly refers to device mount, appear angle direction rotation offset, the main reason of its production has the following aspects: (1) PCB board reason a: PCB board curvature warp degree exceeds equipment allowable range b: support pin height inconsistent, make printed board support not flat. C: table support platform flatness **. d: circuit board wiring precision is low, consistency is poor, especially the batch and batch between the difference is big. (2) The blowing air pressure is abnormal when mounting. (3) Mount suction nozzle suction with air pressure is too low, in taking pieces and posting should be above 400mmHG. (4) Adhesive, solder paste coating quantity abnormal or deviation. (5) Program data equipment is incorrect. (6) The nozzle end is worn, blocked or sticky with foreign matter. (7) Bad parallelism between nozzle unit and X-Y table or bad detection of nozzle origin. (8) Mounting nozzle rising or rotating movement is not smooth, more sluggish. (9) The optical camera is mounted with an improper pillar or data equipment. (10) blowing air timing sequence and paste loading head down timing sequence does not match. C, smt placement machine components lost: mainly refers to the components in the suction position and patch position between lost. The main reasons for its generation are the following: (1) program data equipment error (2) mount suction nozzle suction with air pressure is too low. In take down and posting should 400MMHG above. (3) blowing air timing sequence and affixing should fall timing sequence does not match (4) The posture detection supply sensor is bad, the reference equipment error. (5) reflector, optical identification camera cleaning and maintenance. D, smt mounter take parts is not normal: (1) braided tape specifications and feeder specifications do not match. (2) vacuum pump did not work or suction nozzle suction air pressure is too low too low. (3) in the pick-up position braided plastic hot press tape did not peel, plastic hot press tape is not normally pulled up. (4) The vertical movement system of the suction nozzle is sluggish. (5) The mounting speed of the mounting head is incorrectly selected. (6) Feeder installation is not firm, feeder thimble movement is not smooth, fast opening and closing device and pressure tape is not good. (7) Paper cutting knife can't cut braided tape normally. (8) The braid cannot rotate normally with the gear or the feeder does not run continuously. (9) The suction nozzle is not at the low point when the piece is in the suction position, the drop height is not in place or there is no action. (10) The nozzle centre axis

SMT process terminology 1、Surface mount assembly (SMA) (surface mount assemblys) Surface mount technology is used to complete the mounting of printed board assembly parts. 2、Reflow soldering（reflowsoldering） By melting the solder paste which is pre-distributed to the PCB pads, realize the connection between surface mount components and PCB pads. 3、Wave soldering (wavesoldering) The dissolved solder, through the special equipment spray flow into the design requirements of the solder wave, so that the PCB pre-equipped with electronic components through the solder wave, to achieve the connection between the device and the PCB pads. 4、Fine pitch (finepitch) Less than 0.5mm pin pitch 5、Pin coplanarity ( leadcoplanarity ) Refers to the surface mount component pin vertical height deviation, namely the pin * high foot bottom and * low pin bottom form the plane which between the vertical distance. Its value is generally not greater than 0.1mm. 6、Solder paste (solderpaste) By the powdered solder alloy, flux and some play a sticky role and other role of additives mixed into a certain viscosity and good thixotropy of the solder paste. 7、Curing (curing) In a certain temperature, time conditions, heating the placement of the components of the chip adhesive, in order to make the components and PCB board temporarily fixed together in the process. 8、Patch adhesive or called red glue (adhesives) (SMA) Before curing has a certain initial viscosity has a shape, after curing has sufficient adhesive strength of the gel. 9、dispensing (dispensing) When the surface mount, to the PCB to apply the process of chip adhesive. 10、Dispensing machine (dispenser) Can complete the dispensing operation equipment. 11、Placement (pickandplace) The operation of picking up and placing surface-mounted components from the feeder to the prescribed position on the PCB. 12、Patching machine (placementequipment) Finish surface mount component placement function of special process equipment. 13、 High-speed placement machine (high placement equipment ) The actual placement speed is greater than 20,000 points / hour placement machine. 14、 Multi-function placement machine (multi-function placement equipment ) Used to mount the surface mount device with larger body shape and smaller lead pitch, and requires higher placement accuracy. 15、 Hot air reflow soldering ( hotairreflow soldering ) The reflow soldering which heats up by the forced circulating hot air flow. 16、Patching inspection ( placement inspection ) After the completion of the patching, for whether there is leakage, misalignment, paste the wrong, components damage and other quality inspection. 17、 Stencil printing (metal stencil printing ) The use of stainless steel stencil will be printed on the PCB pad solder paste printing process. 18、 Printing machine (printer) In SMT, stencil printing for special equipment. 19, after the furnace inspection (inspection after soldering ) The quality inspection of the PCBA soldered or cured by the reflow oven after the patching is completed. 20、Inspection before soldering    After the completion of the patch in the reflow oven soldering or curing before the patch quality inspection. 21、Reworking (reworking ) To remove local defects in the PCBA and the repair process. 22, rework station (reworkstation ) Can have quality defects of the PCBA for reworking special equipment.

Panasonic mounter MV2VB beginner's knowledge I. Panasonic mounter MV2VB primary education 1. Do not short the safety switch at will 2. Machine failure, must stop to solve 3. Do not look directly at the laser light 4. There are 5 emergency stop switches II. Panasonic mounter MV2VB on/off procedure MAIN CPU ON Computer start up OPERATION READY ON Machine self-test ORG H-axis origin: 64°～74° Home position confirmation: " * " is displayed III. Panasonic mounter MV2VB password setting PASS 1 PASS 2 PANASERT IV. Panasonic mounter MV2VB component naming 1. Axial machine: 26mm, 52mm braided tape. 2. Radial machine: 2.5mm, 5mm braided tape. 3. 3. SMT: Naming the component name with external dimensions. CHIP components: metric 32162125160810050603 imperial 0805060304020201IC Component: DIPSOPQFPBGACSPPLCCLCC pin insertion two sides with feet four sides with feet on the bottom of the piece (ball type) pin inward curved side with feet V. Panasonic mounter MV2VB installation precautions 1. power supply: AC200V ± 5%, three-phase four-wire system. 2. single-phase power supply: AC100V±5%. 3. compressed air > 0.49MPa ≈ 5KP/cm2. 4. Working ambient temperature: 20℃±10℃. VI. Panasonic placement machine MV2VB machine main unit introduction 1. 12 rotating working head (difference: high-speed machine TABLE moving, medium-speed machine HEAD moving) 2. LOADER/UNLOADER3. unit HEAD of the working head4. FEEDER CARRIAGE5. material frame single: K, QTYPE double: K, Q TYPE 8 × 2 plastic handle = black 8 × 4 plastic handle = white 8 × 4 plastic handle = green material frame fixed way: "K" TYPEPITCH 21.5mm single shelf 21.50mm double shelf 10.75mm "Q" TYPEPITCH 20.0mm single shelf 20.00mm double shelf 10.00mm *Size of the machine: M 330×250 PCB size * large 50×50 PCB size * Small XL 510×450 PCB size*Large 50×50 PCB size*Small VII. The principle of Panasonic mounter MV2VB. 1 position: Vacuum valve open (VS), feeding mechanism, suction height compensation (VT), large part detection, cutter, PUSH UP PIN (K: Yes Q: No). 2 positions: Θ1 coarse adjustment: 0° 90° 180° 270° 4 angles 3 bits: Detects the presence of components and determines the component thickness. 4 bits: Reflection and transmission identification. (CT) High density placement, component gap ≤ 0.2mm, component position on the nozzle offset, easy to hit the component when posting. With SHUTTER. component bigger, SHUTTER off, form total reflection. mv2fmv2vb relative transmittance light source (halogen lamp) normally bright uncontrolled controllable reflective plate white orange reflective light source (LED) red orchid 5 bits: empty. 6 position: Θ2 Fine adjustment: < 90° rotation range. 7 position: Mechanical valve control (suction, blowing) Action: blow valve open (MS), placement height compensation (MT). panasert height compensation standard: overfill 0.2mm. 8 position: empty. 9 position: nozzle type detection and throwing. 10 position: Nozzle selection execution. (NS) 11 bit: Nozzle selection detection. 12 bits: Θ3 Nozzle home position. VIII. Z-axis operation mode (75+75) 1. Part type > 75 can be connected 2. Part type < 75 can be used in exchange/priority exchange/preparation (fixed) mode IX. CAMERA specifications PCB CAMERA: 6mm×6mm Part identification camera: 1. Small field of view camera 6mm×6mm 2. Large field of view camera 20mm×20mm PITCH = 0.50mm 32mm×32mm PITCH = 0.65mm X. Program tolerance number NC program: 200 PCS (5000 STEPS/1 program) A RRAY program: 200 PCS MARK program: 500 PCS PCB program: 200 PCS PARTS program: 1000 PCS XI. Production product switching 1. Machine back to ORG 2. Remove all SUPPORT PINs on X-Y TABLE 3. Select program SETUP: NC, ARRAY, PCB; production condition: OK 4. Adjust PCB STOPPER, POSITION PIN 5. Install SUPPORT PIN 6. Confirm STOPPER, POSITION PIN by SEMI LOADING 7. AUTO RUN XII. Panasonic placement machine MV2VB working environment 1. Ambient temperature: 20 ± 10 degrees Celsius 2. Working pressure: 0.49Mpa 3. Placement speed: 0.1 second (8MM braided tape XY TABLE moving distance <15MM FEEDER fixed) 4. Placement angle: 0°~ 359.99° 5. control part: use semi-closed loop control AC SERVO MOTOR; pulse motor open loop 6. Placement range: MAX: 330*242 MIN: 50*42 7. Processing PCB size: MAX： 330*250 MIN： 50*50 8. PCB transfer time: 2.4 seconds 9. PCB program editing: Input the actual width of PCB board 10. Material station: 75 + 7511. Flow rate: 0.1 m3/min XIII. NC program preparation BLOCK: Program line number X, Y: POSITION Z No: station number S S: The function of piecing the board, consisting of 2 digits: Decimal: 0 - pan 1 - 90 degrees clockwise 2 - 180 degrees clockwise 3 - 270 degrees clockwise   Digit: 0 - no repeat; 1 - step repeat; 2 - graphic repeat θ: rotation angle  MOUNT NO: Whether to mount or not to mount Select 0 - mount 1 - no mount SKIP: Conditional jump code: 1 to 6, 8, 9 Unconditional code: 7 No jump: 0 MARK: 0 - No MARK 1 - Component MARK 2 - PCB MARK 3 - Patchwork MARK  LND: 0 - no pad show 1 - pad show BAD MAR

SMT Process Introduction Types of SMT processes Type I Assembly with surface mount components only  IA single-sided assembly with surface mount only  Process:Silkscreen solder paste=>Mounted components=>Reflow soldering  IB only surface mount double-sided assembly  Sequence:Silkscreen solder paste=>Placement component=>Reflow soldering=>Reverse side=>Silkscreen solder paste=>Placement component=>Reflow soldering The second type of assembly using surface mount components on one side and surface mount components mixed with perforated components on the other side   Process: silkscreen solder paste (top side) => mount components => reflow soldering => reverse side => spot glue (bottom side) => mount components => drying glue => reverse side => insert components => wave soldering The third type of top surface using perforated components, bottom surface using surface mount components assembly  Process: Dispensing=>Placement component=>Drying adhesive=>Reverse side=>Insert component=>Wave soldering   Receive PCB, placement components Placement program entry, track adjustment, furnace temperature adjustment Loading PCB       Dispensing (printing) Lamination Inspection Curing Inspection Packaging Custody   Process requirements and characteristics of each process.   1. Preparation before production l Clear the product model, PCB version number, production quantity and batch number. l Clear the type, quantity, specification and substitute material of components. l Clear the name of SMD, dispensing, printing program. l Clear Feeder list. l Have production operation instruction card and clear instruction card content.  2. Requirements for machine changeover l Make sure the machine program is correct. l Make sure the components of each feeder position correspond to the feeder list. l Make sure all track widths and positioning pins are in the correct position. l Make sure all feeders are properly and securely mounted on the table. l Verify that all feeders have the correct feeder spacing. l Make sure that the upper and lower plates of the machine are not smooth. l Check if the dispensing volume, size, height and position are suitable. l Check whether the amount, height and position of printed solder paste are suitable. l Check whether the placement component and position are correct. l Check whether air bubbles are generated after curing or reflow.