• Categories:Industry News
• Author:Becky Su
• Origin:
• Time of issue:2022-12-02 11:48
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(Summary description)How to buy a bonder? What is a medium speed bonder,what is a high speed bonder? Many people who are new to SMT production lines are hesitant about what kind of bonder to buy, whether to purchase a medium speed bonder? Or high speed bonder? First, the following talk about the difference between medium speed bonder and high speed bonder, for buying machine friends reference. 1, according to the mounter placement speed distinction (1)Theoretical placement speed of medium speed bonder is generally 20000< piece/h (piece component) or so; (2)High speed mounter's theoretical mount speed is generally 30,000～80,000 pieces/h per hour (this mainly refers to mount 0201 01005 following piece type component as standard). 2,SMT mounter model structure: (1)Medium speed mounter mostly uses arch frame type structure, relatively speaking the structure is simple, covers an area smaller, the requirement for environment is lower (2) high speed mounter more modular design (10 more than 20 years ago the turret structure has been discontinued, by the times out). 3, from the mounter mount products on the distinction. Medium speed mounter mainly can be used as mount large components, high precision components and shaped components, can also mount small chip components; high speed mounter mainly available to mount small chip components and small integrated components. 4,From SMT mounter applicable range distinction. (1)Medium speed bonder is mainly used in some small and medium-sized electronic production and processing enterprises, research and development design centre and product characteristics for many varieties of small batch production enterprises widely used; (2) High-speed bonder is mainly used in large electronic manufacturing enterprises and some professional original equipment manufacturing enterprises (OEM) in a large number of. 5, from the price aspect to distinguish: Medium-speed bonder price is relatively cheap, high-speed bonder is generally medium-speed bonder price expensive 60% or so. After understanding the difference between medium speed and high speed bonder, you can combine your budget to buy the machine you like. Two, examples of medium speed bonder, high speed bonder brand models: 1, medium speed bonder (biased towards high speed bonder) Hanwha bonder SM481plus model parameters:  Positioning: flying camera + fixed camera (optional)  The number of mounting axis pole: 10 axis pole x 1 cantilever  Mounting speed: 40,000 CPH (*optimal condition)  Corresponding components:    01005 ~ □42mm (H 15mm)  PCB size (mm):    460(L) x 400(W) 510(L) x 460(W) (option)   610(L) x 510(W) (option) 740(L) x 460(W) (option)  PCB thickness: 0.38 - 4.2mm  Number of feeders (8mm base): 120ea/112ea  Energy consumption.   Power supply AC200/208/220/240/380/415V(50/60HZ,3Phase)         Max.4.7kva   Air consumption 0.5-0.7MPa(5-7kgf/cm2) 160N/min  Dimensions: 1,650(L) x 1,680(D) x 1,530(H)  Weight: approx. 1655kg 2,High speed bonder Hanwha mounter SM471plus model parameters.  Mounting speed.   78,000 CPH(Optimum)  Number of axial rods: 10 axial rods x 2 cantilever  Corresponding components.   01005~ □14mm(H 12mm)  Mounting accuracy    50Л@レ+3ヲ/Chip   Substrate size (mm).   Single track Max. 510(L) x 460(W)        Max. 610(L) x 460(W)(Option)   Double rail Max. 460(L) x 250(W)        Max. 610(L) x 250(W)(Option)   PCB thickness: 0.38-4.2mm  Number of feeders (8mm base): 120ea/112ea  Energy consumption.   Power supply AC200/208/220/240/380/415V(50/60HZ,3Phase)         Max.5.0kva   Air consumption 0.5-0.7MPa(5-7kgf/cm2) 350N/min  Dimensions: 1,650(L) x 1,690(D) x 1,485(H)  Weight: approx. 1820kg