Problems that should be noted when dispensing glue Products are prone to many defects in dispensing: substandard glue dot specifications, glue dipping, pulling, bad curing strength easy to fall off and other problems. To solve these problems, the overall study of its technical parameters should be.  1、Needle specifications 　　In the actual operation, the inner diameter of the needle specification should be about 1/2 of the diameter of the dispensing glue point, dispensing process, according to the industry specifications to select the dispensing needle. In the process of dispensing, the dispensing needle should be selected according to the industry specifications. Different needles should be selected for industries with different specifications, so as to ensure the quality of the glue dot and improve the production efficiency.  2、Dispensing pressure 　　The dispensing equipment provides a certain pressure to the syringe (glue gun) to ensure the glue supply, and the pressure specification determines the glue supply volume and glue flow rate. Too much pressure may cause glue overflow and too much glue; too little pressure may lead to intermittent glue dispensing and leakage, thus causing industrial defects. The pressure should be selected according to the nature of the glue and the operating temperature. High peripheral degree Celsius will make the glue viscosity smaller and fluidity better, then the pressure value should be adjusted down, and vice versa.  3、Specification of dispensing volume 　　According to the operation experience, the specification of glue dot diameter should be half of the industrial spacing. This will ensure that there is sufficient glue to bond the components and avoid too much glue. The amount of glue dispensed is determined by the length of time, and in practice, the dispensing time should be selected according to the production situation (room temperature, viscosity of the glue, etc.).  4、Viscosity of glue 　　The viscosity of glue directly affects the quality of dispensing. If the viscosity is large, the glue point will become smaller, even pulling; if the viscosity is small, the glue point will become larger, and then it may bleed into the industry. In the process of dispensing, the glue with different viscosity should be selected with reasonable pressure and dispensing speed.  5、The distance between the needle and the operating surface 　　Different dispensing machines use different needles, and some needles have a certain stopping degree. The calibration of the distance between the needle and the operating surface should be done before each operation starts, i.e. Z-axis height calibration.  6、Curing degree Celsius curve 　　For the curing of the glue, the manufacturer has generally given the Celsius curve. In practice, a higher degree Celsius should be used as far as possible to cure, so that the glue cured with sufficient strength.  7、Bubbles     The glue must not have bubbles. A small bubble will cause many industries without glue; every time when replacing the hose midway should empty the air at the connection to prevent the phenomenon of empty play.  8、Glue Celsius degree 　　The general epoxy resin glue should be kept in the refrigerator at 0~5℃, and taken out half an hour in advance when applying, so that the glue Celsius degree is consistent with the operation surrounding. The application degree of glue should be 23℃～25℃; the peripheral degree of Celsius has great influence on the viscosity of glue, the degree of Celsius decreases and the viscosity increases, the flow of glue becomes smaller accordingly, and the phenomenon of drawing is more likely to appear. The difference of 5℃ in the peripheral degree Celsius under the same condition will cause a 50% change of the glue output specification, so the peripheral degree Celsius should be controlled. At the same time, the surrounding temperature should also be given to ensure that the temperature is too high glue point easy to dry, affecting the bonding force.  9、The fluid instant glue which needs special setting: for water-based instant glue, apply **type piston and Teflon lined metal needle, for thick instant glue, apply conical slanting needle, if need flexible, apply PP needle.    Anaerobic glue: apply 10CC syringe and white PE general purpose piston.    UV glue: apply amber syringe, white piston and oblique needle (can cover UV) If you apply other kinds of needles, please order the needle that can cover UV.    Light-curing glue: Apply black opaque syringe to avoid light sensitivity.    Sealant and paste fluid: if the application of white piston rebound serious, please change to ** type live type, the application of oblique needle.  10、 Needle selection concise comparison table   　In production should be adjusted in accordance with the actual situation of each parameter, both to ensure the quality of production, but also to improve production efficiency. For the adjustment of each parameter, should be adjusted by point and

AOI automatic optical inspection instrument Automated Optical Inspection (AOI, Automated Optical Inspection) 　　I. Definition 　　Using high speed and high precision vision processing technology to automatically detect different kinds of mounting errors and soldering defects on PCB boards. 　　PCB boards can range from fine pitch high density boards to low density large size boards, and can provide in-line inspection solutions to improve production efficiency and solder quality. 　　By using AOI as a defect reduction tool, errors can be found and eliminated early in the assembly process to achieve good process control. Early detection of defects will prevent bad boards from being sent to subsequent assembly stages, and AOI will reduce repair costs by avoiding scrapping unrepairable boards. 　　Second, the main features 　　1) High-speed inspection system 　　Independent of PCB mounting density 　　(2) Fast and convenient programming system 　　- Graphical interface for 　　-Automatic data inspection with mounting data 　　-Fast editing of inspection data using component database 　　3）Use of a wealth of special multifunctional inspection algorithms and binary or grayscale 　　(3) Inspection using a wide range of dedicated multifunctional inspection algorithms and binary or grayscale optical imaging processing technology 　　4) Automatic correction of the detection window according to the instantaneous change of the position of the inspected component 　　Automatic correction to achieve high accuracy detection 　　(5) Detection by marking directly on the PCB with ink or by graphical error representation on the operation display 　　on the operating display with graphic errors to check the detection of electricity

SMT Common Knowledge SMT Common Knowledge Introduction　 　   1 . Generally speaking, the temperature of SMT workshop is 25±3℃.  　　2. Solder paste printing, the materials and tools needed to prepare the paste, steel plate, scraper, wipe paper, dust-free paper, cleaning agent, stirring knife.    　　3. generally used alloy composition of the paste is Sn / Pb alloy, and the alloy ratio of 63/37. 4.    　　4. The main components of the solder paste is divided into two major components of tin powder and flux. 5.    　　5 flux in the soldering of the main role is to remove the oxide, destroy the surface tension of molten tin, to prevent re-oxidation. 6.    　　6. The volume ratio of tin powder particles to Flux (flux) in solder paste is about 1:1, and the weight ratio is about 9:1.    　　7. The principle of taking solder paste is first in first out. 8.    　　8. when the paste is opened and used, it must go through two important processes: tempering and stirring.    　　9. The common production methods of steel plate are: etching, laser, electroforming.    　　10. The full name of SMT is Surfacemount (or mounting) technology, Chinese meaning for surface adhesion (or mounting) technology. 11.    　　11. the full name of ESD is Electro-static discharge, the Chinese meaning is electrostatic discharge.    　　12. When making SMT equipment program, the program includes five major parts, this five parts are substrate data; mounting data; loading data; component data; absorbing data, image data.    　　13. lead-free solder Sn/Ag/Cu 96.5/3.0/0.5 melting point of 217C. 14.    　　14. The controlled relative temperature and humidity of the parts drying oven is < 10%.    　　15. commonly used passive components (PassiveDevices) are: resistance, capacitance, point sense (or dipole), etc.; active components (ActiveDevices) are: crystals, IC, etc.    　　16. The material of the commonly used SMT steel plate is stainless steel.    　　17. The thickness of the commonly used SMT steel plate is 0.15mm (or 0.12mm).    　　18. The types of electrostatic charge generated by friction, separation, induction, electrostatic conduction, etc.; electrostatic charge on the electronics industry: ESD failure, electrostatic pollution; electrostatic elimination of the three principles of electrostatic neutralization, grounding, shielding.    　　19. imperial size LxW 0603=0.06inch*0.03inch, metric size LxW 3216=3.2mm*1.6mm.    　　20. The 8th code "4" of ERB-05604-J81 indicates 4 circuits with 56 ohms resistance value. Capacitor ECA-0105Y-M31 capacitance C = 106PF = 1NF = 1X10-6F.    　　21. ECN Chinese full name: engineering change notice; SWR Chinese full name: special requirements work order, must be countersigned by the relevant departments, the documentation center to distribute, in order to be effective.    　　22. 5S specific content for the organization, tidying, cleaning, cleanliness, literacy.    　　23. The purpose of PCB vacuum packaging is to prevent dust and moisture.    　　24. The quality policy is: **Quality control, implementation of the system, to provide the quality of customer needs; full participation, timely processing, to achieve the goal of zero defects.    　　25. The three no policies of quality are: do not accept ** products, do not manufacture ** products, and do not flow out ** products.    　　26. QC seven techniques in the fishbone check the cause of 4M1H are (Chinese): people, machines, materials, methods, environment.    　　27. The composition of the solder paste contains: metal powder, solution, flux, anti-drop agent, active agent; by weight, metal powder accounts for 85-92%, by volume metal powder accounts for 50%; where the main components of metal powder for tin and lead, the ratio of 63/37, the melting point of 183 ℃.    　　28. Solder paste must be taken out of the refrigerator when using back to temperature, the purpose is: let the refrigerated temperature of the paste back to room temperature, in order to facilitate printing. If not return to temperature in the PCBA into the Reflow easy to produce ** for tin beads.    　　29. the machine's file supply mode are: ready mode, priority exchange mode, exchange mode and quick connect mode.    　　30. SMT PCB positioning methods are: vacuum positioning, mechanical hole positioning, bilateral clamping positioning and board edge positioning.         31. The resistor with a silkscreen (symbol) of 272 has a resistance value of 2700Ω, and the resistor with a resistance value of 4.8MΩ has a symbol (silkscreen) of 485.    　　32. The silkscreen on the BGA body contains information such as manufacturer, manufacturer's part number, specification, and Datecode/(Lot No).    　　33. The pitch of 208pin QFP is 0.5mm.    　　34. the seven QC practices, the fishbone diagram emphasizes the search for cause-and-effect relationships;    　　35. CPK refers to the current process capability under actual conditions;    　　36. Flux starts to evaporate in the constant temperature zone for chemical cleaning act

FUJI NXT mounter There is no waste corresponding to the module that achieves high quality placement.   FUJI NXT mounter It is possible to constitute a production line with reasonable cost that matches the production pattern. It is possible to introduce the necessary equipment when necessary and to anticipate the correspondence for the future technology.   Flexible change of machine composition Not only when installing the machine, but also when changing the working head after the production line is in operation and changing the die set can be done more easily than before. This enables dynamic line changes beyond the range of common knowledge, in line with the new production methods that require rapid changes.  

Ultra-high speed modular bonder cm602 Ultra-high speed modular bonder cm602 CM402 created the myth of SMT sales, in just over 2 years time global sales of more than 3000 units. With its flexible, combination of stable production and ** cost-effective loved by the majority of customers, widely used in notebooks, MP4, cell phones, digital products, automotive electronics and other ** industry. With the continuous improvement of product processing technology, the placement machine also put forward higher requirements. In order to meet the requirements of industry development and better serve our customers, Panasonic Industrial Co., Ltd. has improved and developed the CM602, a new generation of mounter**, based on the original CM402.   The CM602 not only uses the original CM402 modules, but also adds a new 12-nozzle high-speed head and direct-absorbing tray as needed, expanding the original 8-nozzle high-speed bonder head function, plus the 3-nozzle multifunctional head with pressure control function, making it as many as 10 different module combinations, truly modular, allowing customers to combine and match at will. The high speed version of CM602* reaches a high speed of CPH100,000, and the speed of a single bonder head reaches CPH25,000, which is unmatched by other equipment in the industry at present. New linear motors are adopted for both XY axes to provide strong power to CM602.    ● The motion arm beam and head adopt new design and material, which not only reduce the weight but also greatly strengthen the rigidity, making it more stable during the motion.    ● High-speed and low-vibration design has been adopted for the X Y axis movement.    ● The linear motor adopts a new cooling design scheme, which enables faster and more effective cooling than other equipment using linear motors in high-speed motion, ensuring efficient operation and increasing the life of the motor.    The 7 types of racks can be used for all kinds of ribbon packaging components from 8mm to 104mm, which is the most versatile and widely applicable equipment in the industry. The new 8 mm single rack has been added according to customer demand.    The design of the overall exchange cart and the overall exchange support pin can greatly improve the operation efficiency and the machine switching time.    While improving productivity, the software, hardware, and operation are all based on the proven design of the CM402, ensuring interchangeability with the CM402. Equipment name ： CM602 Power supply: 3 phase 200/220/380/400/420/480V 50/60Hz 4KVA Air pressure: 0.49-0.78MPa 170L/min Equipment size: W2350xD2690xH1430mm Operation: color LCD touch panel, Chinese, Japanese and English three kinds of one-touch switch Object component: 0603-100X90mm Number of tape: Multi 216 stations 8mm tape Object substrate: 50X50-510X460mm