SMT Quality Terminology 1、The ideal solder joint   Good surface wettability, that is, the molten solder should be spread on the surface of the metal being soldered and form a complete, uniform and continuous solder coverage layer, the contact angle of which should be no greater than 90.    The correct amount of solder, the amount of solder is sufficient but not too much or too little    Good soldering surface, the surface of the solder joint should be complete, continuous and rounded, but does not require a very shiny appearance.    Good solder joint position component's solder end or pin on the pad position deviation within the specified range. 2、No wetting    The solder on the solder joint and the soldered metal surface to form a contact angle greater than 90 degrees. 3、Open soldering    After soldering, the pads are separated from the PCB surface. 4、Drawbridge (drawbridging)    One end of the component leaves the surface of the solder pad to the upper diagonal or upright, also known as the tombstone (Tomb stone). 5, bridging    Two or more should not be connected between the solder joints connected to the solder, or solder joints of the solder and adjacent wires connected. 6、False soldering    After soldering, the solder end and the pad between or between the pins and pads sometimes appear electrical isolation phenomenon 7、Pull tip    Solder joints appear in the solder has a prominent outward burr, but no contact with other conductors or solder joints 8、Solder ball (solder ball)    Soldering adhered to the printed board, negative solder film or conductors on the solder ball, also known as tin beads. 9、Holes    Solder holes of varying apertures 10、Position shift (skewing )    Solder joints in the plane lateral, longitudinal or rotational direction deviation from the intended position. 11、Visual inspection method (visual inspection)    With the aid of a 2-5 times magnifying glass illuminated, the quality of PCBA solder joints is inspected by visual observation. 12, after welding inspection (inspection after aoldering)    PCB quality inspection after completion of welding. 13、Reworking (reworking)    To remove local defects in the surface assembly components of the repair process. 14、Placement inspection ( placement inspection )    Surface mount component placement or after completion, for whether to miss paste, misalignment, paste wrong, damage and so on the situation of quality inspection.

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Control method of SMT material consumption As the question, I believe this problem is troubling many SMT people. In fact, the key to control SMT material consumption is to improve the measures 　A, control the artificial waste　　 1, the use of materials and the number of returns should be carefully verified every day. 2, disassembly material improper waste: training of equipment operators, corresponding to the form of packaging using the corresponding material frame 　　3、Waste of using wrong material, heavy industry: each shift should have 3 times to check the material, change the material corresponding to the material tray in the way of one for one, confirmed by special personnel, and test the value. 　  4、In order to pursue the output, the operators change the material in advance and consume the material without finishing. This phenomenon should be supervised to avoid. 　　5、The abnormal consumption caused by machine and equipment failure. Timely detection of the problem can minimize the loss. 　　6, for the normal production on the line when the residual products generated by the rework consumption, this is not yet controlled. 　　 Second, the material loss of serious control measures, performance for the people \ machine \ material \ law 　　People: mainly refers to the production line operators, usually they are on the material, down the line, in the end there is no real view of each material as gold, fell on the ground material has not put up, and hand swing. Machine frequent alarm when whether timely reflection of engineering, etc. 　　Machine: usually whether the machine is practically executed maintenance operation, whether the nozzle is often cleaned and tested, whether the material frame is often maintained and corrected, whether the program is correctly written, etc. 　 Material: whether the material has incoming material abnormality, such as incoming material packing is too tight, can't get material throwing material; incoming material is broken, replacement loss, etc. 　　Law: such as the operator's proficiency in operating the machine, the ability to distinguish and reasonably use the material frame, etc. 　　 　In summary, the control of SMT material consumption from a variety of aspects, and long-term implementation of reasonable methods.

Electric plug PCB need to follow which design specifications 1. Scope This standard specifies the use of automatic plug-in machine for electronic assembly of electronic products in the design of printed circuit boards (hereinafter referred to as printed circuit boards) should follow the technical specifications. This standard applies to the use of automatic plug-in machine design of printed circuit boards. 2. Reference standards The provisions contained in the following standards become the provisions of this standard by referencing them in this standard, and the versions shown are valid when this standard is published. All standards are subject to revision, and parties using this standard should explore the possibility of using the * new version of the following standard: FSX40036-1995 Single-sided printed circuit board design guidance specifications. 3. Requirements Other design requirements of the printed circuit board shall be in accordance with FSX40036-1995. The shape of the printed board: the shape of the printed board should be rectangular, with the radius of the four corner arcs between 2 and 4mm; * the large size is: 400mmX300mm, * the small size is: 150mmX100mm. The warpage of the printed board: * the big upward warpage 0.5mm, * the big downward warpage 1.2mm  When the printed board needs to be partially cut off the edges or corners, the method of process punching should be used so that the part to be cut off can be retained until the automatic insertion process is completed and then removed. If the edge is to be opened, the width of the opening should not exceed 3mm and the depth should not exceed 30mm; the distance between the opening and the nearby corner should be more than 35mm; there should not be more than 5 openings on the same edge; avoid opening on the long edge as much as possible. Translated with www.DeepL.com/Translator (free version)

SMT Basics I. Introduction to the traditional process     The traditional perforated electronic assembly process is to insert the pins of the component into the PCB guide holes after fixing, using the wave soldering (WaveSoldering) process, as shown in Figure 1, after flux coating, preheating, solder coating, inspection and cleaning steps to complete the entire welding process. Introduction to Surface Bonding Technology    As products in the electronics industry continue to be designed to be shorter and lighter with time and trends, the size and weight of various components are becoming smaller and smaller, and their functional density is also relatively higher in order to meet the trend of the times and customer needs. The main feature is that it can be used as a space-saving alternative to the traditional dip-solder assembly (DualIn Line Package; DIP). The surface mount assembly process consists of the following main steps: solder paste printing, component placement and reflow soldering. The steps are outlined below.     StencilPrinting: Solder paste is the material used to connect the surface bonded components to the PCB. After the steel plate is etched or laser cut, the squeegee of the printing machine prints the paste onto the PCB pad through the holes in the steel plate in order to proceed to the next step.     ComponentPlacement: Component placement is the key technology and focus of the entire SMT process, which uses highly sophisticated automated placement equipment, programmed by computer, to accurately place surface-adhesive components onto the solder pads of the printed PCB. As the design of surface mount assemblies becomes more sophisticated, the pitch of the pins becomes smaller and the technical level of the placement process becomes more and more difficult.     ReflowSoldering: Reflow soldering is the process of placing the PCB with surface adhered components, preheating it in a reflow oven to activate the flux, then raising the temperature to 183°C to melt the solder paste and connect the component pins to the PCB pad, then cooling it down to cure the solder, which completes the bonding of the surface adhered components to the PCB. III. Explanation of SMT common names     SMT : surface mounted technology: an assembly technology in which surface-mounted components are directly mounted and soldered to the surface of a printed circuit board at specified locations.     SMD : surface mounted devices: rectangular shaped, cylindrical or heterogeneous electronic components with solder ends or pins made in the same plane and suitable for surface adhesion. Reflow soldering: The mechanical and electrical connection between the terminals or pins of a surface-adhesive component and a printed circuit board solder pad by remelting a paste that has been pre-assigned to the pad.     Chip : rectangular chip component (rectangular chip component): a surface-adhesive component with no leads at both ends, with solder ends, and a thin rectangular shape.     SOP : small outline package (small outline package): a small moulded plastic package with short wing or J-shaped pins on both sides, a surface assembly component.     QFP : quad flat pack: a plastic package with short wing-shaped pins on all four sides, with a pin pitch of 1.00, 0.80, 0.65, 0.50, 0.40, 0.30mm, etc. for thin surface assembled collective circuits.     BGA: Ball grid array: a form of packaging for integrated circuits in which the input and output points are tin balls arranged in a grid pattern on the bottom surface of the assembly. IV. Assembly packaging methods.     Magazine/stick (shipping tube) - the main component container: the magazine/stick consists of a transparent or translucent polyethylene (PVC) material extruded into a standard form that meets current industry standards for application. The dimensions of the strips provide the appropriate positioning and orientation of the components for industry standard automatic assembly equipment. The strips are packaged and shipped in individual strip quantity combinations.     Trays (trays) - the main component container: trays are made of toner or fibre materials, which are selected based on the *high* temperature rate of the special trays. Trays designed for components that require exposure to high temperatures (moisture sensitive components) have a temperature resistance of typically 150°C or higher. The trays are moulded into a rectangular standard profile and contain a uniform matrix of interlocking cavities. The cavities hold the components and provide protection for the components during transport and handling. The spacing provides accurate component positioning for standard industrial automated assembly equipment used for placement in the circuit board assembly process. The pallets are packed and transported as a combination of individual pallets which are then stacked and bundled together with some rigidity. An empty-covered pallet is placed on top of the assembled compone