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SM421S

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HANWHA SAMSUNG SM421S MACHINE


HANWHA SAMSUNG SM421S SMT machine core features analysis 1、Core performance indicators Mounter speed: Theoretical capacity: Chip components up to 21,000 CPH (IPC9850 standard), QFP components 6,000 CPH, support high-speed continuous placement. Efficiency Optimization: OnTheFly dynamic identification technology is adopted to reduce the time consuming component identification and improve the production line efficiency. Placement accuracy: CHIP components: ±50μm@3σ; QFP/IC: ±30μm@3σ, supports high precision placement of 0.4mm pitch micro-pitch components.

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  • DESCRIPTION
    • Brand: HANWHA
    • Commodity name: HANWHA SAMSUNG SM421S MACHINE
    • Commodity ID: SM421S

    HANWHA SAMSUNG SM421S SMT machine core features analysis 1、Core performance indicators Mounter speed: Theoretical capacity: Chip components up to 21,000 CPH (IPC9850 standard), QFP components 6,000 CPH, support high-speed continuous placement. Efficiency Optimization: OnTheFly dynamic identification technology is adopted to reduce the time consuming component identification and improve the production line efficiency. Placement accuracy: CHIP components: ±50μm@3σ; QFP/IC: ±30μm@3σ, supports high precision placement of 0.4mm pitch micro-pitch components.

    HANWHA SAMSUNG SM421S MACHINE

    HANWHA SAMSUNG SM421S SMT machine core features analysis
    1、Core performance indicators
    Mounter speed:
    Theoretical capacity: Chip components up to 21,000 CPH (IPC9850 standard), QFP components 6,000 CPH, support high-speed continuous placement.
    Efficiency Optimization: OnTheFly dynamic identification technology is adopted to reduce the time consuming component identification and improve the production line efficiency.
    Placement accuracy:
    CHIP components: ±50μm@3σ;
    QFP/IC: ±30μm@3σ, supports high precision placement of 0.4mm pitch micro-pitch components.
    2、Component and substrate compatibility
    Component range:
    Minimum size: 0402 (metric 1005) chips;
    Maximum size: Support □55mm shaped components (e.g. LED modules, large-size ICs).
    Substrate handling capability:
    Standard size: L460×W400mm (single track), expandable to L750×W500mm, suitable for large size LED aluminum substrate;
    Thickness range: compatible with 0.4-3.0mm thick PCB and FPC flexible boards (jig required).
    3、Hardware and system advantages
    Vision system:
    Equipped with Stage Camera high-pixel vision module, support □ 42mm components and complex shape components accurate identification;
    Polygon identification algorithm: automatically adapt to irregular packages (such as BGA, PLCC) placement requirements.
    Feeding system:
    Non-stop electronic feeder: reduces downtime for material changeover and improves production line continuity;
    Buffer nozzle design: reduce the rate of offset and enhance the placement stability.
    4, operation and maintenance characteristics
    Operating system:
    Chinese and English Windows NT interface, support for rapid parameter setting and production plan management, low operating threshold;
    Bad board identification system: automatically skip PCB defective area, reduce material waste.
    Maintenance Convenience:
    Modularized design: simplify the process of troubleshooting and parts replacement, reduce maintenance costs;
    Anti-collision sensor design: all-round sensor protection of the core components of the device, reducing the risk of accidental damage.

    Summarize: SM421S, with its core competitiveness of high speed and high precision, wide compatibility and user-friendly design, is especially suitable for SM421S is especially suitable for mass production in LED lighting, consumer electronics and other fields, with both efficiency and cost advantages.

     

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