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Key Words:
Tin Lead Free Solder Bar
Sn
AG
Cu Sn
Cu Sn
AG
Tin Lead Free Solder Bar Sn,AG,Cu Sn,Cu Sn,AG
Commodity Number：Tin Lead Free Solder Bar
Tin Lead Free Solder Bar Sn,AG,Cu Sn,Cu Sn,AG
Category:
SMT Periphery Equipment Parts
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Product Description
Tin Lead Free Solder Bar Sn,AG,Cu Sn,Cu Sn,AG
Sn/AG/Cu Sn/Cu Sn/AG
Sn/AG/Cu solder Bar
Solder Bar
lead free solder bar
Product description: Tin Lead Free Solder Bar Sn/AG/Cu Sn/Cu Sn/AG
Our company provides Tin Lead Free Solder Bar with a variety of alloy composition , content and size of the diameter of pharmaceutical different specifications tin for customer choice:
Tin Lead Free Solder Bar Type of Alloy:
| Alloy composition (wt.%) | Diameter | Flux Content | Weight / Roll | Melting pointºC | Working point | Usage & Application | |||
| Type | Tin-Sn | Silver-Ag | Copper-Cu | ||||||
| SAC305 | 96.50% | 3.00% | 0.50% | 0.8-3.0mm | 1.8-2.4% | 750-1000g | 217-219 | 280-320 | LED, IT, PCB, High-class electronics, Lighting industry, Radiators, Household appliance and Precise Instruments, Audio and Sound System and other soldering |
| SAC300 | 97.00% | 3.00% | 0% | 217-220 | 280-320 | ||||
| SAC0307 | 99.00% | 0.30% | 0.70% | 217-225 | 260-320 | ||||
| SAC07 | 99.30% | 0.00% | 0.70% | 227 | 260-280 | ||||
Type of Tin Lead Free Solder Bar:
Anti-oxidation tin lead free bar
High temperature tin lead free bar
Low temperature tin lead free bar
Dim tin lead free bar
Silver tin lead free bar
Tin lead free solder bar for other particular applications
Size of Tin Lead Free Solder Bar:
3.15cm * 1.5cm * 1.0cm
Weight of Tin Lead Free Solder Bar:
500g/PC
Advantages of Tin Lead Free Solder Bar:
Eutectic alloy.
Bridge-free and icicle-free soldering.
Smooth, bright, well-formed fillets, free of gross micro-cracks, irrespective of the cooling rate.
Good through-hole penetration.
Good topside fillet formation.
Dross rate equal or lower than tin-lead solder.
Does not require a nitrogen atmosphere.
Does not erode copper from holes, pads and tracks.
Low rate of copper leaching makes it easy to control the copper content of the solder bath.
Lower aggressiveness to stainless steel and other solder pot materials as compared to tin-silver-copper alloys.
Thermal fatigue resistance and creep strength better than tin-lead.
Slow, even growth of the intermetallic layer at the solder/substrate interface.
Also performs well in selective and dip soldering.
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